Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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X-Ray and CT Inspection
Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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PWB Visual Inspection Machine (AOI/SPI)
RV-2
PWB size: 50mm×50mm - 410mm×360mm 630mm×360mm（longer sized PWB)*. Item of inspection: Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Automatic and Accurate Inspecting Systems
Circuit AOI
The Circuit AOI system is designed to perform automatic and accurate inspecting systems. It integrates rigid mechanical system with advanced vision technology and manufactured and tested by strict is standards. It is suitable for circuit inspection for PCB/FPC, verification and repair. Innovation and unique inspection algorithms are applied to inspect open, short, protrusion, nick, scratch, pin hole, island, line width/space violation, object missing and others defects. AOI system can use offline setup project and check results. It will improve the throughput.Compare to halogen lighting, the full angle LED lighting of Circuit AOI can obtain the best image contrast and is good for different panel type inspection.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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AXI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Semiconductor / FPD Inspection Microscope
MX61L
Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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X5 Pack X-Ray Inspection
Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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Post-Mould Inspection Machine
IV-P1000
The IV-P1000 is a post-mould inspection machine best known for being a fully automatic vision inspection station and for having a user-friendly GUI for operator and recipe setup. This machine is best used to inspect packages for surface defects on top and bottom.
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Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Automatic Flight Inspection System
AT-930DG
Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
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Manual Contactless Wafer Detector
HS-NCS-300
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Hi-Definition Video Inspection Station with Measuring
VIS810
Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Inspection Tools
Multi Disk Test System (4-Port)
16 types of inspection modes can be registered and edited. More accurate acceptance inspections can be performed using various types of inspections.High speed data communications using USB interface for communicating with host computer.Acceleration testing for temperature loaded HDD can also be performed. (Optional)Easy attaching and removing HDD using optional plug-in unit.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Industry-Standard, Automated Precision Inspection Systems
Circuit AOI 4.0
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard DUO
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.2 axis design for rotary tilting applications with self-locking worm gearing and a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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X-ray Inspection System
Cougar ECO / Cheetah ECO
Cheetah and Cougar ECO X-ray inspection systems for use in the electronics industry. These microfocus systems, which have been developed by Yxlon in Germany, are characterized by an excellent price-performance ratio. Being entry-level systems in two sizes, each of them provides best inspection results in quality control in the SMT and semiconductor industries.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Wireless Inspection Cameras
General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Full Wafer Contact Test System
Fox 1
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
