Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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X-ray Inspection System
X-eye SF160 Series
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Inspection Systems
Video Inspection Systems with?or without measurement capabilities are an excellent way to evaluate and test small items or items in?difficult to access locations. Many options are available in addition to the measurement capability. Video Inspection is used for a variety of purposes including the ability to see? and measure items that are much smaller than the eye can see or that hand tools can measure. Video systems can also reduce the eye and/or back strain associated with production environments where an operator must look in a microscope all day.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Backplane Profiling & Inspection System
603d
A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Integrated NDT Inspection Device
FlawHunter
The FlawHunter is an integrated NDT inspection device, equipped with an advanced, high-resolution Laser Shearography sensor with a vacuum (partial) excitation system. It is ergonomic & easy-to-use and is equipped with a workflow-oriented, GUI-display and left/right-hand button control. Regardless of the application, the FlawHunter provides reliable and resolute measurement results for in-field (service) NDT and quality control (post-production) operations.It can be used on any material & surface provided a stable vacuum can be generated within the vacuum seal (viewable inspection area).
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Deep Inspection Kit
GRL-KIT-DI20
The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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STEEL PLATE INSPECTION MACHINE
Yubain Steel Plate Inspection Machine can effectively detect steel plate problems, including pinholes, hole breaks, hole deviations, leaks, multiple holes or few holes... and other shortcomings, which can help customers efficiently inspect incoming materials and inspections in the manufacturing process. , To avoid product damage due to steel plate problems, reduce financial losses and customer complaints.
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Advanced Automated Optical Inspection (AOI)
V510i Optimus 3D
V510 has high productivity, the superior detection capability and inductory fastest inspection speed. It is by High Speed Multi Frequency Phase Shift Profile technology and simultaneous inspection method of 2D/3D. V510 can inspect that without influencing the surface condition and the warp of the board by unique lighting technology.By much algorithm, inspevtion of the component smoothness and the very small component is possible.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Conformal Coating Inspection System
TROI 8800 CI
The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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Low to Modest Volume Clean, Inspect & Test
KI-TK071A
1310/1550 nm & 850/1300 nm source & Autotest power meter + acceptance reporting software, inspection microscope, cleaning materials. Interchangeable MPO, MPO/APC, SC, LC connectors (EAR99 Restricted)
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Thin Film SPY Inspection w/ Built In Jeep Meter
780
For thin film coatings the easy-carry and easy to handle SPY Model 780 speeds inspection time with its built in Jeep meter and various other time saving and comfort features.
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Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Incremental Length Gauges For Measuring Stations And Multipoint Inspection Equipment
CERTO series
*Interferential scanning principle*Very high system accuracy of down to ±0.03 µm*Well-matched ball-bearing guide for very high quality*Defined thermal behavior*Large measuring ranges of up to 60 mm*Interface: 11 µAPP
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Vehicle Inspect Lines Software System
Foshan Analytical Instrument Co, Ltd.
Flexible control mode(A collective-type control mode can be adopted,but a distributive-type control can also be adopted); Powerful system function(Distributive-type control and collective-type management,provide the functions of equipment debugging,vehicle log-in,vehicle testing and bill printing.A secret code and right-limit can be set so that the system safety function is enhanced); Remote control(A remote log-in,main remote control and remote printing can be realized in accordance with the actual conditions of the testing station.At the sametime,provides a powerful data-base and one station with multi-wire:That is one testing station has more
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Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Furnace and Electrical Inspection Camera
FLIR GF309
The FLIR GF309 is designed for high temperature industrial furnace applications. These infrared cameras are ideal for monitoring all types of furnaces, heaters, and boilers, particularly in the chemical, petrochemical, and utility industries. Custom-built to see through flames, the FLIR GF309 also features a detachable heat shield designed to reflect heat away from the camera and camera operator, providing increased protection.
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High Energy Industrial CT X-Ray Inspection System
MeVX Series
The most advanced industrial DR & CT systems in the world are now available with Linear Accelerators. Offered with energies up to 9MeV, the MeVX series of systems provide the same ease of use as our low energy systems in a high energy format. Utilizing our current efX software platform along with the superior service, support & training that we are known for puts these systems in a class of their own.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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Terahertz Imager for Material Inspection
T-SENSE FMI
This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
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Wafer Prober
Prexa
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
