Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Extreme Performance Edge Servers
Ark-7000 Series
ARK-7000 series feature Intel Xeon processors and multiple expansion slots, delivering high-speed data transfer rates and enhanced remote management.
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Internet-Wide, Real-Time Data Sharing via the Cloud and the Network's Edge
Vortex Link
Vortex Link provides universally accessible Routing and Discovery Services that enable ubiquitous and transparent data sharing and WAN connectivity for Vortex DDS systems or any other system/device that uses a compliant Data Distribution Service (DDS) software stack. Vortex Link provides transparent discovery and routing between data readers and data writers regardless of location. Vortex Link supports a number of different deployment and connectivity scenarios, including individual device to cloud, system to cloud and also connecting your different LAN’s to turn them into a single system.
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Edge Gateway
Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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Fanless Edge System With NVIDIA® JETSON™ TX2, 1 HDMI 2.0,2 GbE LANs And 1 USB 2.0
eBOX560-900-FL
The eBOX560-900-FL employs a NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor; a 256 CUDA cores with NVIDIA® Pascal™ GPU Architecture; 8GB of LPDDR4 memory; and 802.11ac Wi-Fi with Bluetooth. It also supports NVIDIA JetPack 3.2 SDK including TensorRT, cuDNN, CUDA Toolkit, VisionWorks, GStreamer, and OpenCV, all built on top of L4T with LTS Linux kernel. The extremely compact system is your superb choices for AI, deep learning, and edge computing. Its tough construction is IP40-rated, and it has an extended operating temperature range of -30°C to +60°C (-22°F to +140°F) and up to 3G vibration endurance.
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Edge Intelligence Server
Edge Intelligence Server(EIS) accelerates IoT implementation by providing integrated solutions and software modules that enable IoT connectivity, data manageability and analytics from edge computing to cloud.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Fanless Edge AI System With NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL
*NVIDIA® Jetson™ Nano with Maxwell™ architecture with 128 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Optional IP42 cover kit for semi-outdoor applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +60°C*JetPack supported
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Edge AI Box
EPC-R7000
EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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4U AI GPU Edge Server
AXE-7400SR
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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WDXRF Wafer Analyzer
2830 ZT
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Edge Press Technology Bed of Nails Testers
Rand Edge Press Family
Designed for Research & Development and Pre-Production environments to support often reoccurring product design changes. The primary design focus for this fixture is ease in applying engineering changes and resilience to the abuse of applying multiple engineering changes without damage. In R&D and Preproduction, design changes and updates can occur every week. This Rand fixture, unlike normal test fixtures was designed to be easily taken apart and updated. Constantly disassembling modifying and reassembling a normal bed of nails test fixture over and over again can be a major disaster with wire breakage and test pin bending issues. The modular design of the Rand fixture allows for easy disassembly without flexing the wires or risk of bending test pins. The Rand fixture provides complete easy access for multiple updates requiring machining, drilling and wiring changes.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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NVIDIA® Jetson™ Xavier NX-based Industrial AI Smart Camera for the Edge
NEON-2000-JNX Series
ADLINK NEON-2000 series is the NVIDIA® Jetson™ based industrial AI cameras, which integrates the Jetson Xavier NX or Jetson™ TX2, Image Sensor, Optimized OS, Rich I/O for vision applications in a compact chassis and verified thermal performance, that saves not only users' TCO (Total Cost Ownership) on the integration and trouble shooting, but also the dimension and cables on the installation.
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NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
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Edge Gateway
EPC-R4760
EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Edge AI Box
EPC-R5710
Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
