Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Long Edge Wet Film Combs (Stainless Steel)
3238
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Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers and IoT gateways to accelerate AIoT development.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
2U 20" Short-Depth Edge Server
HPC-6240+ASMB-622V3
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2U 20" short-depth edge server with a 5th/4th Gen Intel® Xeon® CPU, 4TB DDR5, and 8 PCIe Gen5 slots. Built for high-density AI and edge data centers.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
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- Deep learning acceleration with NVIDIA® Jetson™ TX2- Compact fanless system 148(W)x105(D)x50(H)mm- Wide temperature range from -20°C to 70°C
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Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Edge AI Box
EPC-R7000
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EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Edge AI Inference Systems
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Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
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- Deep learning acceleration with Jetson Xavier™ NX- Compact fanless system 148(W)x120(D)x49.1(H)mm*- Wide temperature range from -20°C to 70°C
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Automated Control System for Veneer Edge Gluing Line
Vikat
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The automated veneer splicing line control system is designed to identify defective veneer areas, control the scrap trimming, bonding of suitable areas and the formation of output sheets of a given size.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Edge Intelligence Server
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Edge Intelligence Server(EIS) accelerates IoT implementation by providing integrated solutions and software modules that enable IoT connectivity, data manageability and analytics from edge computing to cloud.
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
