Showing results: 1 - 5 of 5 items found.
-
Insight Scientific
BOSA Module Auto Assembly MachineKey Features:Compatible with pigtailed and pluggable BOSA module.Visual image parameter collection, detection, classification, recording functions included.
-
Insight Scientific
The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
-
Insight Scientific
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
-
Insight Scientific
Aged wafer equipment upgrade all control hardware & software and operation system, expand data connectivity for industrial 4.0.
-
Insight Scientific
This is the fully automatic semiconductor probe assembly and test equipment. It features ultra high precision in assembly process and the intelligent inspection of the finished products. This product is one of the most technologically advanced equipment by international standards in this industry and been exported to North America.Key Features: ● Assembly Precision：15um ● UPH:720 ● Visual Inspection included ● Spring Force Test
