Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Intelligent Edge Orchestration
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Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
iBMC Edge Intelligent Solution
Controller
Intelligent board management controller (iBMC) is embedded hardware-based technology that allows administrators to conduct power management remotely.
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Product
Edge AI Box
EPC-R7000
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EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Product
Edge Intelligence Server
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Edge Intelligence Server(EIS) accelerates IoT implementation by providing integrated solutions and software modules that enable IoT connectivity, data manageability and analytics from edge computing to cloud.
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Product
Card Edge Connectors
R600
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VECTOR Electronics and Technology, Inc.
R656-2R600 series card edge female connectors for 0.062"(1.57mm) thick boards. Available in wire-wrap or solder tail type termination.Available in 30, 72, 44, 56, 80 and 100 contacts total with dual row.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Edge Connector Fixture
220EDGE
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An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
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Product
Industrial IoT Edge Gateway
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Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Deep Observability For Critical Edge Software
DevAlert
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Get cloud-based observability on anomalies in edge devices and embedded software. Detect and analyse issues remotely, during testing and in deployed devices. Use your familiar desktop tools for secure remote debugging.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
Edge AI Inference System
AIR-101
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Edge AI Inference System powered by Intel Atom® E3940 QC SoC and two Intel MA2485 VPUs. Intel Atom E3940 Quad Core SoC turbo burst up to 1.8 GHz. Intel® Movidius™ Myriad™ X VPU MA2485 x 2 Built-in.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Edge AI Acceleration Modules
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The EAI series provides low power plug-in AI modules and GPU cards to help accelerate deep learning inference on the edge
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Product
Signage & Edge Computers UBX-300 Series
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NUC-sized edge computers equipped with Intel® Core™ Ultra Processors provide flexible I/O expansion and AI computing power.
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Product
Edge AI Inference System
AIR-055
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Edge AI Inference system powered by Qualcomm Dragonwing™ IQ-9075 processor up to 100 TOPS. Compact and high performance Edge AI box at least 100 TOPS AI computing. Qualcomm ® DragonWing IQ9075 processor built-in.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
Edge AI Inference System
AIR-030
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Edge AI Inference system powered by NVIDIA® Jetson AGX Orin™ and 3 x 2.5GbE Lan. Compact and high performance AI box. NVIDIA® Jetson AGX Orin™ 64GB and 32GB Modules.
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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