Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
WDXRF Wafer Analyzer
2830 ZT
-
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
-
Product
Compact 2U Edge Server
SKY-8234D
-
Compact 2U Edge Server based on Dual 4th Gen Intel® Xeon® Scalable Processors for enterprise virtualization, software-defined storage.
-
Product
Edge Connector Fixture
EDGE
-
An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
-
Product
Contactless Wafer Geometry Gauge
MX 20x series
-
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
Product
Wafer ESD Tester lineup
-
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
-
Product
Edge AI & Intelligence Solutions
-
Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
-
Product
Wafer Back Side Cooling System
GR-300 Series
-
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
-
Product
Inline Wafer Testing
IL-800
-
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
-
Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
-
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
-
Product
Intelligent Edge Orchestration
-
Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
-
Product
Wafer Inspection Machine
IV-W2000
-
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
-
Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
-
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
-
Product
1U Short-Depth Edge Server
HPC-6120+ASMB-610V3
-
1U short-depth edge server with Intel® 14th Gen. Core™ CPU, 128GB DDR5, and 4 PCIe slots. Ideal for machine vision, and factory automation.
-
Product
Multi Access Edge (MEC)
-
The 5G future is open and disaggregated. Gain access to Radisys Edge offerings to accelerate time-to-market and reduce costs by leveraging a full cloud-native solution for virtualized or containerized deployment on any COTS hardware and access to a dedicated network services team.
-
Product
360° Edge Analytics
-
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
-
Product
UHD Edge Video Server
-
The VEGA 7000 is a family of highly configurable video processing servers which has been optimized to scale throughput of live video applications.
-
Product
Ultrasonic Wafer Scanner
AutoWafer
-
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
-
Product
Compact 2U Edge Server
SKY-821E3
-
Compact 2U edge server with dual AMD® EPYC™ 9005/9004 processors, optimized for virtualization, HCI, and edge analytics.
-
Product
VUltra-Short 1U Edge Server
SKY-8134S-11
-
vUltra-short 1U edge server with 4th Gen Intel® Xeon® Scalable processor, optimized for Open RAN, MEC, and low-latency edge workloads.
-
Product
Laser Type Edge Detection Sensor
LD
-
Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
-
Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
-
Product
Wafer Internal Inspection System
INSPECTRA® IR Series
-
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
-
Product
2U Edge Server
SKY-7632D
-
2U edge server with dual 3rd Gen Intel® Xeon® CPUs, massive expansion, and high-density storage. Optimized for AI inference, CDN, and edge data caching.
-
-
Product
Manual Contactless Wafer Detector
HS-NCS-300
-
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
-
Product
Edge Press Technology Bed of Nails Testers
Rand Edge Press Family
-
Designed for Research & Development and Pre-Production environments to support often reoccurring product design changes. The primary design focus for this fixture is ease in applying engineering changes and resilience to the abuse of applying multiple engineering changes without damage. In R&D and Preproduction, design changes and updates can occur every week. This Rand fixture, unlike normal test fixtures was designed to be easily taken apart and updated. Constantly disassembling modifying and reassembling a normal bed of nails test fixture over and over again can be a major disaster with wire breakage and test pin bending issues. The modular design of the Rand fixture allows for easy disassembly without flexing the wires or risk of bending test pins. The Rand fixture provides complete easy access for multiple updates requiring machining, drilling and wiring changes.
-
Product
Edge Gateway
EPC-R4680
-
EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
-
Product
Equipment Front End Module Wafer Handler
Sigma EFEM
-
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
Product
Edge Gateway
EPC-R6410
-
EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
