Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
Berliner Glas KGaA Herbert Kubatz GmbH & Co.
We make use of extensive measurement techniques and develop individual measurement setups in order to ensure that our optical components, assemblies and systems comply with your specifications. We create own software to measure customer-specific parameters.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Materials Metrology
Nova is a market leader for innovative thin film metrology and process control technologies. We develop highly sensitive in-line metrology solutions on high productivity platforms, thereby enabling critical metrology solutions to be closer to a semiconductor fab’s process and integration needs.Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
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Dimensional Metrology
Fleet Connectivity & Control Family
Nova’s Fleet Management and Performance Monitoring Center simplify the management and enhance the productivity of Nova tools in the fab. The platform’s ability to process and analyze large amounts of fleet and metrology data using advanced data analytic tools provides our customers with intelligent and predictive insights on tool performance and process trends.
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Surface Imaging & Metrology Software
Mountains®
Analyze multiple types of surface data. Turn your surface data into accurate, visual surface analysis reports. See every feature with high quality real-time 3D imaging of surface topography. Characterize surfaces in accordance with the latest metrology standards.
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Dimensional Metrology
Integrated Metrology Family
Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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In-Line Metrology
For industrial applications, k-Space is known for its ability to provide robust data and analysis for in-line solutions in production environments. k-Space works side by side with the customer to understand their specific measurement and inspection needs, and then develops a custom solution to meet the identified requirements. Our solution includes custom measurement technology, software, database generation and integration, go/no go determination, pick and place, alarm status, and PLC communication.
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Advanced Metrology System
AMS Series
Precision systems for accurate measurement and quality control in semiconductor manufacturing.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Metrology System
Echo
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Optical Metrology
Complex measurements can be performed quickly and easily with optical measuring solutions from ZEISS. With a high degree of automation and state-of-the-art sensors, they reduce operating errors and guarantee high measuring accuracy.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Metrology System
Aspect
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Metrology Equipment
Exact Metrology sells, services and implements metrology equipment from the 3D scanning industry's leading manufacturers. Our highly trained team can configure our comprehensive lineup of portable CMMs, 3D scanners, 3D laser scanners and 3D metrology equipment & digitization equipment and software for practically any application.You'd have to scan far and wide to find a more inclusive selection of 3D metrology equipment. We sell everything from Faro arms to 3D body scanners; white light scanners to blue light scanners; coordinate measuring machines to desktop 3D scanners.
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3D Metrology Solutions
SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Manual Semiconductor Metrology System
Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Dimensional Metrology System
PINNACLE PLUS
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Metrology Device
XPLOR 100
XPLOR 100 is a state of the art, fully automated metrology device designed for measurement and analysis of bubbles and inclusions for optical substrates in the Visible and NIR wave-bands.
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Metrology System
IVS
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Process XRR, XRF, and XRD metrology FAB tool
MFM310
Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Thin Film Metrology Systems
Gemini Series
The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Materials Metrology
VeraFlex Family
World-class XPS and XRF metrology technologies for semiconductor process control.
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Metrology System
IMPULSE V
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Metrology System
CCC System
Our versatile and robust Cryogenic-Current-Comparator (CCC) system allows high-quality measurements with a fully computer controlled system.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Metrology
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Network analyzers are used to measure so-called scatter parameters (S-parameters). These describe the behaviour of electrical components with the help of wave magnitudes. Whether simple cables, filters, amplifiers or complex subsystems, the following applies to all these components: Different loads can have unseen effects on the measured values over time.
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Robotic Inspection Made Easy
i-Robot
The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
