Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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DC Current Shunts
DC current shunts / standards are true 4-terminal devices that precisely measure DC currents from 10 A to 10,000 A. They use special alloys in the resistive elements which are supported on an insulating base for mechanical stability. The 9230A includes special features to reduce the effects of power dissipation and associated self heating errors. These shunts are designed to operate in air at full rated current. These are the best performing, and most widely used, DC metrology shunts in the world.
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MEMS And Sensor Test Automation Platform
Sense+
Sense+™ ultra-precise MEMS & sensor test automation platform allows for significant improvement in test accuracy, parallelism for a lower cost of test, and the ability to handle and inspect, small delicate sensors. Fully configured, Sense+ delivers a one-pass automated test, inspection, and metrology for the most complex MEMS devices including <1 mm WLCSP.
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Multiple Angle Reflectometry
FilmTek 4000
Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Compact Horizontal Gage
1302
The Adcole Model 1302 represents a significant advance in precision metrology, and is an essential part of the production process for sliding cam and shifting camshaft components. The camshaft gage features two opposing measuring heads to maximize speed and achieve faster cycle time, while still delivering the sub-micron accuracy and repeatability that have defined Adcole gages as the world standard in cam/crank metrology.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Express Analyzer
MAYA Express
Lyncis Express Analyzer was developed to answer the need for fast and reliable material chemical composition analysis. The application is valued by the clients where modern agile manufacturing metrology being applied and quick assessment of material is necessary to adjust critical process parameters without waiting on the lab results.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Photovoltaic/Solar Metrology System
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Solar Photovoltaic
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film.
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Metra Scan 3D
The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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Metrology System
IMPULSE V
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Offline Programming, Advanced Simulation & Digital Twin
Silma
Improve your 3D measurement experience with a winning combination: Silma, for advanced simulation and digital twin of your 3D measurement process, and Metrolog for on-machine execution and analysis.
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Bottle Cap Torque Meter
HN-B
Shenzhen Chuangxin Instruments Co., Ltd.
HN-B Series Cap Torque Meter is an intelligent metrologic instrument and is designed for detecting and calibrating the torsion of various caps. Installation of clamps is easy, rapid and its max diameter can reach 200mm.You can connect it to PC by USD output and transmit data for analysis and printing.
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Engineered Measurement Solutions
Our mission is to deliver integrity based calibration services, cost effective metrology engineering solutions for individual customer requirements, reputable instrument repair services, sales of industry-known brands of test equipment, and full service test engineering, from integration of hardware and software, to documentation and training.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Dimensional Metrology
Fleet Connectivity & Control Family
Nova’s Fleet Management and Performance Monitoring Center simplify the management and enhance the productivity of Nova tools in the fab. The platform’s ability to process and analyze large amounts of fleet and metrology data using advanced data analytic tools provides our customers with intelligent and predictive insights on tool performance and process trends.
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Infrared Microscope
DDR200/300 NIR
The McBain DDR200 NIR (for 200mm) and DDR300 NIR (for 300mm) provide high-speed defect detection and precision measurement on wafers and other parts. These cost-efficient systems offer unique advantages for both production and process development use, providing an optimum near-infrared (900-1700nm) solution when both subsurface defect detection and dimensional metrology are required.
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SPC Software Gauging Software
Solartron Metrology offer three Software packages which offer the user different features at different prices.
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Static and dynamic analysis
MEMS
Static and dynamic analysis and visualization are critical parts of the test and development process for MEMS microstructures in order to characterize surface metrology and measure in and out of plane motions. The PS4L Adaptive Architecture is ideal for configuring a system to perform tests to very specialized requirements of the MEMS customer. MEMS customers often require vacuum probing, which is available in semiautomatic and fully automatic configurations.
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Portable Metrology‑Grade 3D Scanner
Black Series
The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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Industrial Lenses
ZEISS lenses for technical applications are key components in complex production processes (Machine Vision) as well as in optical metrology, medical applications, traffic enforcement, quality assurance, sports and many other applications. Here they prove their outstanding image performance and reliability. Due to the precise manual adjustment of the helical focusing mount our partners will gain much better results than with comparable lenses.
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Mid-end
Growth in the advanced packaging market and the challenges raised by the various packaging types requires the highest level of inspection and metrology, ensuring high yields of each die as well as of the whole package.
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QE Systems
Abet Technologies offers a range of standard EQE and IQE measurement systems. Model QE-1100 is configured with the most useful components for single junction devices. It has a 350 – 1100 nm range. The QE-1800 is configured with components most useful for components for triple junction cells. Beyond the standard systems offered systems can be custom configured to meet a customer’s metrology needs.
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Metrology Software
ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Metrology System
Echo
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Programming
You are looking for a LabVIEW-solution for a test problem? LabVIEW is an excellent development environment for all areas of metrology. Here we have extensive experience and can help in your test problems. In the LabVIEW programming language, we develop VIs (Virtual Instruments) that can be integrated easily in TestStand. Using hardware-oriented programming languages such as C# and LabVIEW, we develop integrations of control and measurement components.
