Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Emulation Platform
Veloce
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The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Product
Programming on-chip flash in your processor
XJDirect
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XJDirect is an advanced and innovative method for programming the internal flash of your processor and implementing some aspects of board test through JTAG when traditional boundary scan techniques cannot be used.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
cRIO Modules
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The cRIO technology (RIO = reconfigurable I / O) from National Instruments enables the creation of customized measurement and control hardware circuits based on FPGA chips using the NI LabVIEW graphic development tool. The cRIO core comprises an FPGA chip and surrounding circuits that allow LabVIEW to perform a hardware synthesis.
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Product
CMOS Cameras
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A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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Product
ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
Arduino CAN Shield
IFB-10003-ANP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
ARINC 429 Bus Interfaces
Interface
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
Intelligent Power Switches
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ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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Product
Thin Film Current Sensing Chip Resistors
CSTN
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*Thin film process*High power rating up to 3 watts in 2512 size*Resistance values from 50m to 1ohm*High purity alumina substrate for high power dissipation*Power management applications*Switching power supply*Over current protection in audio applications*Voltage regulation module (VRM)*DC-DC converter, battery pack, charger, adaptor,*Automatic engine control*Disk drive
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Encoders
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DekTec encoder cards use hardware compression chips to achieve very low CPU overhead. Ideal for converting the output of your video-generating application to H.264 in real-time, without consuming precious CPU cycles.
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Product
DisplayPort v1.3 Protocol Analysis Probe
FS4500
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The FuturePlus FS4500 DisplayPort Analysis Probe provides a mechanical, electrical and software interface to the DisplayPort bus, a digital display interface standard supported by the Video Electronics Standards Association (VESA). The FS4500 is used to design and debug computer motherboards, monitors, home theater systems, and silicon chips incorporating DisplayPort technology.
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Product
Digital Color Camera for Microscopy
LC30
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The LC30 is a 3.1 megapixel digital color camera for microscopy that combines versatility with performance. The LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications. The Olympus LC30 color camera for microscopy combines versatility with performance. With up to 37 frames per second (fps), faithful color reproduction, full integration into Olympus imaging platforms, and an excellent cost-performance ratio, the LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications.. The sensitivity and frame rate of the 3.1-megapixel CMOS chip can be increased using various binning modes, resulting in easy observation and focusing. The LC30 camera can be quickly and easily mounted on all microscopes equipped with a standard C-mount adaptor, and requires only a single USB 2.0 cable for high-speed data transfer and power supply. Its complete integration into the OLYMPUS Stream imaging platforms helps ensure the seamless interaction of microscope, camera, and additional devices, delivering intuitive and efficient operation.
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Product
Imaging
SLA64 (Preliminary)
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A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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Product
Chip-Type Attenuators
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Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Product
Inductor Tester
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An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Product
Receivers
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Macom Technology Solutions Holdings Inc.
MACOM's receivers are widely used in point-to-point radio, aerospace and defense, and other broadband communications applications. Operating between the 4.5 - 45 GHz frequency range, our receivers feature an integrated LNA, mixer and LO buffer amplifier onto a single chip. Available in lead-free QFN or SMD packages, our receivers boast excellent noise figure and conversion gain performance.
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Product
isoPower
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Analog Devices isoPower® technology utilizes proprietary iCoupler® chip scale transformers to integrate isolated dc-to-dc converts with data isolation into a single package. This enables designers to implement isolation in designs without the cost, size, power, performance, and reliability constraints found with optocouplers. With more than one billion channels shipped into the field, these magnetically isolated products are a safe, reliable and easy-to-use alternative to optocouplers.
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Product
2000-6000W AC power source
CX-P2KW
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage, over current, over temperature, overload protection. It can output 0-300V adjustable voltage, and 45-70Hz adjustable frequency as well as fixed frequency as 50 Hz or 60 Hz, 100 Hz and 200 Hz and 400 Hz. This AC power source can simulate power grid of different countries, provide a stable voltage, frequency, waveform which can be used to test and age the exprot products and provide kinds of precision tests for laboratory, measuring room, etc.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
Digital Input/Output Card
IOD-144
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This is a 144-bit full-size card. A Programmable Peripheral Interface chip, type 8255-5 provides three 8-bit ports (A, B, and C) for each 24-bit group. Each port can be independently programmed for either input or output. Port C can also be configured as two 4-bit ports. These cards fully implement Mode 0 of the 8255 PPI chip. (Consult the factory if you desire to operate in Mode 1.) Type LS245 bi-directional transceivers sink 24 mA (optionally 64 mA) and source 15 mA. These transceiver buffers provide hysteresis correction on inputs and added drive capability on outputs. The direction of the transceivers is set by software.
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Product
MEMS Tunable Filter
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Optoplex’s MEMS Tunable Optical Filter is based on a patented micro-optic design with MEMS tuning technology. It is an integrated module consisting of a MEMS chip, micro-optics and control electronics and interface. When receiving a stream of optical signals of a plurality of wavelengths from the Input-Port (IN), the 2-port tunable optical filter directs a selected channel to the Output-Port (OUT). Wavelength (frequency) tuning is achieved by changing driving voltage applied to the MEMS chip, via the control electronics and the built-in firmware.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
High Speed Spectroscopy Camera
SynapsePlus CCD
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Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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Product
Piezo-resistive Accelerometer
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A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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Product
ARINC818 Cards
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> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
