Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
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The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
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Product
Resister
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Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Product
Clock Distribution Devices
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Analog Devices offers ultralow jitter clock distribution products that fan out given signals for wireless infrastructure, instrumentation, broadband, ATE, and other applications demanding subpicosecond performance. Our clock products are ideal for clocking high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Product
32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
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12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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Product
Demonstration Board
SAMPULSE20x2
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The SAMPULSE20x2 is a demonstration board for the Furaxa SiGe3 30GHz sampler/pulser IC. The SIGe3 IC is a dual channel sampler pulser chip, and the SAMPULSE20x2 demonstration board contains two 2.4mm combined TDR input/output connectors, one to each sampler/pulser channel in the IC. The SiGe3 IC's two sampler outputs are then sent to to two SMA jacks, the first outputting the sample taken on the rising edge of the sampler clock, and the second containing the sample taken on the falling edge of the sampler clock. The sampler clock input, which must be a square wave, may be set to any frequency from 5MHz to 1GHz, causing the board take two pairs of samples (one on each clock edge) at rates from 5 million to 1 billion per second. A pulser clock input, which may be set to any frequency from 5MHz to 2GHz, and MUST be a square wave (preferably differential) with rise time under 100pS, causes the board to produce concurrent pulses on both of the SiGe3's I/O pins, which produce near-concurrent pulses at the two 2.4mm sampler/pulser TDR input/output connectors.
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Product
32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
MIPI Video Devices
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The abundance of the MIPI® interface in mobile applications has driven its proliferation into other application areas such as the automotive and broader consumer environments. Analog Devices, an established provider of video products, offers a range of MIPI video devices that provide interfaces to the latest generations of system on chip (SoC) processors. Typical applications for MIPI video devices include the rear-view camera function in the automotive environment and HDMI® output from portable devices featuring a MIPI-capable SoC. The MIPI video device portfolio offers a variety of solutions.
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Product
Optical Sensors
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Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
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Product
Digital Input/Output Card
IOD-144
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This is a 144-bit full-size card. A Programmable Peripheral Interface chip, type 8255-5 provides three 8-bit ports (A, B, and C) for each 24-bit group. Each port can be independently programmed for either input or output. Port C can also be configured as two 4-bit ports. These cards fully implement Mode 0 of the 8255 PPI chip. (Consult the factory if you desire to operate in Mode 1.) Type LS245 bi-directional transceivers sink 24 mA (optionally 64 mA) and source 15 mA. These transceiver buffers provide hysteresis correction on inputs and added drive capability on outputs. The direction of the transceivers is set by software.
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Product
Rugged SODIMM DDR4 2666/3200
SQR-YD4N
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Motion Control Solutions
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DDC offers a complete line of Synchro/Resolver instrument-grade cards and test equipment including angle position indication and simulation, plus a variety of hardware and software to meet today’s civil, military, and COTS/MOTS requirements. DDC is a leading supplier of Synchro/Resolver-to-Digital and Digital-to-Synchro/Resolver components—the smallest, most accurate synchro/resolver-to-digital and digital-to-synchro/resolver converters available today. Most of these single chip and hybrid converters are based on ASIC designs, yielding the most reliable and affordable converters ever offered, and are the building blocks for DDC’s card-level products.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Product
MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
Pressure Sensors
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ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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Product
Optical Spectrum Analyzers
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Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines.
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Product
Stone-chip (Gravelometer)
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Trialon routinely tests products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
PCI Express Digital I/O Card With Counters And IRQ
PCIe-DIO-24HC
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This product is a x1 lane PCIe DIO board with basic DIO, Counter/Timers and interrupt generation capabilities. The card uses an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C is further broken into two 4-bit nybbles via software, configured as either inputs or outputs.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
10-CH General-Purpose Timers/Counters & 8-CH Digital I/O Card
PCI-8554
Digital I/O Module
- Supports a 32-bit 5 V PCI bus- On-board four 82C54 programmable timer/counter chips- 10-CH independent 16-bit down counters- 1-CH 32-bit cascaded timer- Four programmable clock sources for each timer/counter
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Product
GO-NR1000 Near-Field Goniophotometer
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Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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Product
LED’s
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Marktech offers the complete line of both CREE LED’s High Brightness LEDs and Marktech’s custom designed components and assemblies which utilize CREE LED’s chips. Our main focus has always been in the area of application solutions to optimize your products performance. Our team of design engineers and R&D scientist are committed to providing you with unsurpassed technical support.
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Product
96/48-CH Opto-22 Compatible PCI Express Digital I/O Cards
PCIe-7248/7296
Digital I/O Module
ADLINK"s PCIe-7248/7296 are high-density parallel digital I/O boards with 96/48 I/O channels. The header connectors are fully compatible with industry Opto-22 standard. Thus, PCIe-7248/7296 can utilize the Opto-22 external devices. The PCIe-7248/7296 devices emulate mode 0 of the industry standard 8255 programmable peripheral interface (PPI) chips. The PCIe-7248/7296 provides 4/2 PPI chips respectively. Each PPI offers three 8-bit ports: Port A, Port B and Port C. The Port C is divided into 2 nibble-wide (4-bit) ports. The PCIe-7248/7296 devices have programmable timer/counters. One 16-bit counter is available for event counting, while the other 32-bit timer is available for timed interrupt generation. The PCIe-7248/7296 devices provide multiple programmable interrupt sources from DIO channels, as well as the output of the timer.
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Product
FMC Quad ADC 16-bit @ 1 GSPS and Quad DAC 16-bit @ 2.8 GSPS
FMC231
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The FMC231 is an FPGA Mezzanine Carrier (FMC) per VITA 57 specification. The board has quad ADC (the ADC chips are dual channels) and quad DAC (the DAC chip is quad channel). The FMC231 utilizes TI ADS54J60 (option for ADS54J69) providing 16-bit conversion rates of up to 1.0 GSPS and a DAC DAC39J84 providing 16-bit conversion rates of up to 2.8 GSPS.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
