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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
Pressure Mapping
NIP PRESSURE MEASUREMENT SYSTEM
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A completely wireless system for measuring nip pressure between rollers in real-time
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Pressure Mapping
WIPER
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Evaluate wiper blade force profiles and interface pressure distribution.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Non-Contact Mapping Life Time System
MWR-2S-3
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The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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Product
Continuous Surface Current Mapping & Wave Monitoring System
SeaSonde
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The SeaSonde HF radar system by CODAR Ocean Sensors is your solution for making continuous, wide-area ocean observations. The SeaSonde will provide you with years of real-time data over large coverage areas, with ranges up to 200 km — This is not possible with any other technology!
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Phased Array Corrosion Mapping Software
Concerto
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Concerto is a UT acquisition and analysis software specially designed for Phased Array corrosion mapping. For the tough field conditions that operators deal with Concerto features no menu, less than 18 icons, and few controls so that operators can easily work and not be bothered by complex GUIs. Concerto is simple and easy to work with yet WT, Surface, and back wall C-scan can still be analyzed and setting can be changed using the same acquired data.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
On-line MAP Gas Analyzers
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Our online MAP gas analyzers continuously extract and monitor packaging gas from the Modified Atmosphere Packaging line to ensure that the equipment and gas mixing system deliver a desirable protective atmosphere which meets the requirements for prolonged shelf-life products within the food & beverage and pharmaceutical industries.
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
Magnetic Field Camera: mapping for MRI applications
MFC2046
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MRI and NMR spectroscopy applications require a highly uniform magnetic field, within at most a few ppm. NMR is the only magnetic measurement technique capable of providing a field map with that degree of precision. Introduced 25 years ago, Metrolab’s NMR Magnetic Field Cameras have revolutionized field mapping for MRI magnets. They reduced acquisition times from hours to minutes, positioning errors to fractions of a millimeter, and they rendered human and drift errors negligible. Now, meet the latest generation NMR Magnetic Field Camera, the MFC2046! Map any magnet with the New generation of MFC probe arrays. Magnetometer Teslameter Gaussmeter
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Product
MPI PA Wafer Probers
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MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
