-
Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
-
The MX30x series are manual one-point Thickness gauges for silicon wafers.
-
Product
STDF Test Data Analysis Tool
DataView
-
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
-
Product
LED Type Wafer Alignment Sensor Controller
HD-T1
-
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
-
Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
-
Product
Stress Mapping System
900 Series
-
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.
-
Product
WAFER MVM-SEM
E3300 Family
-
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
Product
WAFER MVM-SEM® E3300 Series
E3310
-
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
-
Product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
-
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
-
Product
Silicon & Compound Wafers
-
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
-
Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
-
Product
Wafer Auto Line Integration
-
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
-
Product
04 With Pins For PCB | 1 Wafer | 12 Positions
04-1xx4-20/70-xx
-
Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
-
Product
Equipment Front End Module Wafer Handler
Sigma EFEM
-
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
Product
Pressure Mapping
TIRESCAN
-
Complete pressure imaging system for conducting tire tread analysis.
-
Product
Wafer Chucks
-
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
-
Product
Wafer Sort
-
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
-
Product
Locate and Map Underground Utilities
UtilityScan DF
-
Geophysical Survey Systems, Inc.
UtilityScan DF incorporates our innovative dual-frequency digital antenna (300 and 800 MHz) and an easy-to-use touchscreen interface to view shallow and deep targets simultaneously in a single scan.
-
Product
Wafer Flatness Measurement System
FLA-200
-
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
-
Product
04 With Pins For PCB | 3 Wafers | 24 Positions
04-3xx3-20/70-xx
-
Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
-
Product
Pressure Mapping Sensors
-
The pressure sensors listed below are available in a wide range of shapes, sizes, pressure ranges, and resolutions. Over 200 different pressure sensors are available. High Temperature pressure mapping sensors are also available in certain sensor models. Custom tactile pressure sensors and pressure ranges can also be created to meet your specific application requirements. Please note, the sensors listed in this catalog are matrix sensors designed to be used with one of Tekscan's pressure mapping systems. If you need single-point force sensors for testing, or custom force sensors for embedded/OEM applications, please refer to our FlexiForce™ products. For more application and industry details, see some of our key sensor application and industry solutions.
-
Product
Temperature Mapping Sensors
-
Tekscan's thin-film temperature mapping sensors can track real-time temperature data changes between almost any two mating surfaces.
-
Product
Wafer Internal Inspection System
INSPECTRA® IR Series
-
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
-
Product
01 With Pins For PCB | 12 Positions | M8 | 2 Wafers
01-2xxx-20/70xx-12-0
-
This compact multi-deck rotary selector switch features twelve discrete positions across two wafers, combining a slim M8 profile with reliable performance for complex PCB-mounted applications. It offers high-reliability gold-plated contacts and a 30° detent angle, delivering consistent indexing and robust switching action. Designed for demanding environments, it’s ideal for use in precision industrial, aerospace, and defense modules where space-efficient, dependable switching is required.
-
Product
One click site mapping
PowerMapper
-
PowerMapper is an automatic site mapping tool for information architects, usability analysts and web developers. It is used in more than 50 countries, by 30% of the Fortune 100, and major organizations like NASA and MIT.
-
Product
Single Wafer Transfer Tools
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
-
Product
01 With Soldering Eyelets | 12 Positions | M6 | 2 Wafers
01-2xxx-00/30xx-12-M
-
Multi wafer compact selector with 30° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
-
Product
Inline Wafer Testing
IL-800
-
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
