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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- PalmSens BV
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Integrated Potentiostat and Multiplexer
EmStatMUX8
Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode. The MUX16 is suitable for sensor arrays or chips with sixteen working electrodes all sharing a RE and/or a CE. Both instruments are suitable for laminated layer corrosion analysis.The potentiostat is controlled and powered by USB and is used with PSTrace allowing for simultaneous sampling of each channel at a rate of 25 ms/channel. Standard packaging includes a shielded cable with connections for a working, a counter and a reference electrode by means of 2 mm banana connectors and mini-crocodile clips, a stripped end, Dsub-37 terminated flat cable and a USB cable. To make connections to chips simpler the Connection Terminal is an optional extra providing clearly marked screw terminals to the electrodes and can be directly joined to the ESMUX via their D-Sub connectors.
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Fixed Clamp-on Flowmeter
D116
Gentos Measurement & Control Co.
D116 Series Ultrasonic Flowmeter is a state-of-the-art universal transit-time flowmeter designed using FPGA chip and low-voltage broadband pulse transmission.
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Combination Board Tester
ATE QT2256-640 PXI
Qmax Test Technologies Pvt. Ltd.
Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or micro controller based boards. ATE QT2256-640 PXI system is designed as a combination board tester capable of testing highly complex and PCBs employing various techniques on a single platform. It can be easily upgraded to 640 digital channels and with programmable UUT power supplies, IEEE or PXI external instrumentation, Bus cycle signature system, ICE and integrated Boundary scan Test AC/DC parametric testing. The ATE is interfaced to an external host PC using a PCI express interface card allowing a maximum data transfer rate. Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or microcontroller based boards.
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29MP Ultra-High Resolution Forensic Camera
SceneScope RUVIS 29MP System
The SceneScope RUVIS 29MP is an Ultra High Definition camera based on a 29MP sensor with 6644 x 4452 pixel resolution, and a full-frame chip. It includes capture software with 3 user-selectable modes: Fast Viewing for placement, Focus on the evidence, and High Detail for Capture at High Resolution and High Dynamic Range.
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Multi-Radio Host-Less Platform
SX-ULPGN-BTZ
SX-ULPGN-BTZ is a dual band a/b/g/n Wi-Fi, Bluetooth low energy (BLE), 802.15.4 combo module for the Internet-of-Things (IoT). It is a single stream 1x1 WLAN, BLE 5 + 802.15.4 based on Qualcomm's QCA4020 System-on-Chip (SoC).
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Fast Temperature Shift
CherryTemp
CherryTemp is a temperature controller based on two independent Peltier channels, allowing for very accurate temperature control and ultra-fast shifts from 5°C to 45°C. A thermalization liquid circulates from a reservoir to the heat exchangers (heating/cooling Peltier elements) where it is thermalized to a target temperature. Once thermalized, this liquid can be quickly injected to a microfluidic device (CherryTemp chip) mounted near the sample. Because of the small thermal mass (the distance between the microfluidic chip and the sample), the temperature transfer is very fast (less than 10 seconds) and of unprecedented accuracy due to a feedback loop control of the room temperature and the heat-sink played by immersion objective lenses.
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Digital I/O Card
PCIe-DIO-48JPLS
The PCIe-DIO-48JPS is a 48 channel PCI Express (PCIe) card designed for use in a variety of digital I/O applications. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI digital I/O cards.
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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AC Quantum Voltmeter
are based on a programmable Josephson voltage standard chip and are used for high-precision voltage measurements in the range from dc and ac to kHz frequencies.
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Step Recovery Diodes
SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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SparkFun GPS Breakout
NEO-M9N, Chip Antenna (Qwiic)
The SparkFun NEO-M9N GPS Breakout with on-board chip antenna is a high quality GPS board with equally impressive configuration options. The NEO-M9N module is a 92-channel u-blox M9 engine GNSS receiver, meaning it can receive signals from the GPS, GLONASS, Galileo, and BeiDou constellations witn ~1.5 meter accuracy. This breakout supports concurrent reception of four GNSS. This maximizes position accuracy in challenging conditions, increasing precision and decreases lock time; and thanks to the onboard rechargeable battery, you'll have backup power enabling the GPS to get a hot lock within seconds! Additionally, this u-blox receiver supports I2C (u-blox calls this Display Data Channel) which made it perfect for the Qwiic compatibility so we don't have to use up our precious UART ports. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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Storage Technologies
We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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CMOS SoC for mmWave 3D Imaging Sensor
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Vayyar chip covers imaging and radar bands from 3GHz-81GHz with 72 transmitters and 72 receivers in one chip. Enhanced by an integrated, high-performance DSP with large internal memory, Vayyar’s sensor does not need any external CPU to execute complex imaging algorithms.
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Miniature Solid-State Relays
Series C47F
The Series C47F miniature solid-state relays utilize a photovoltaic generator driving high-performance power FET chips to provide low-output on resistance and high-output switching capability. The virtual elimination of offset voltage makes these relays ideal for low level switching applications as well. Bidirectional switching versions (Series C46F) are available. MSL 6Available options include:C47F-10 1.75A, 50Vdc Load; 3.8-32Vdc ControlC47F-20 1A, 90Vdc Load; 3.8-32Vdc Control C47F-30 0.6A, 180Vdc Load; 3.8-32Vdc ControlC47F-40 0.4A, 360Vdc Load; 3.8-32Vdc Control
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Humidity Sensors
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Saluki SEL8 Series Programmable DC Electronic Load (up to 200KW)
The new SEL8 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL8 series delivers high speed and high accuracy with a resolution of 1mV and 1mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL8 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.* Customization available upon request
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Chip Test Adapter
SOJ EDO/FPM
Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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IR Sensor
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Universal Programmer Superpro 7500
Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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ICs For Wireless Charging System
The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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(IoT) Wireless Module
SX-59HLS
The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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Sealed Linear Encoders
Sealed linear encoders feature optimal protection from dust, chips, and splash water. They are especially ideal for use in manually operated machine tools and also in numerically controlled machine tools.
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Thin Film Current Sensing Chip Resistors
CSTN
*Thin film process*High power rating up to 3 watts in 2512 size*Resistance values from 50m to 1ohm*High purity alumina substrate for high power dissipation*Power management applications*Switching power supply*Over current protection in audio applications*Voltage regulation module (VRM)*DC-DC converter, battery pack, charger, adaptor,*Automatic engine control*Disk drive
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PIN Diodes
The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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PCIe 4.0 RAID Controller
MegaRAID 9560-16i
The MegaRAID 9500 series is the industry’s first PCIe Gen 4.0 RAID adapter family, offering PCIe Gen 4.0 host and storage interfaces. The MegaRAID 9560-16i adapter, based on the SAS3916 high-port count PCIe 4.0 x8 RAID-on-Chip (RoC), delivers twice the performance of previous generations.
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Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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R&D Solutions From Teledyne LeCroy Quantum Data
Teledyne LeCroy offers a wide variety of products for engineers in the R&D lab. R&D testing entails functional testing for source and sink devices as well as interoperability testing for diagnosing problems between A/V devices. Solutions for silicon chip manufactures are available for both source and sink devices. Quantum Data solutions are available for testing HDMI, MHL, DisplayPort, HDBaseT and 3G-SDI products.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
