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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Protocol Control Control
PC2
The PC2 software from SCSI Toolbox, LLC brings a new level of parallel SCSI protocol control to your test environment. Designed in cooperation with LSI Logic to work with their Fusion-MPT Message Passing Interface technology, PC2 allows all negotiated parameters to be displayed or set for all devices connected to any SCSI Host Bus Adapter based on the LSI53C1030 chip set. PC2 also provides the means to generate hardware SCSI bus resets.
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SMD/Chip Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of SMD/Chip Resistors including conventional Thick Film and Precision Thick Chip Resistors as well as specialized Resistors such as Thin Film, Metal Film Chip, Current Sense and more.
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Temperature Forcing System
ETF-SERIES
Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Inductor Products
Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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Intelligent Stirrer
Model 901
Intelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Options of AC and DC. Applied in the field or in the incubator. MoreIntelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Range: 0 to 2300 R/M (no load)Nice appearance, transparent coping designused with AC or DC, and a battery low voltage alarmused in lab, in incubator and brought outdoorsEquipped with strut and electrode holder, it can be used as agitating arc-spark standIP54 dustproof and splash proof.
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KV CAPS
500 V
Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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OBD Chips
STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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.13u ESD diode
Impulse TSMC
The Impulse TSMC .13u ESD diode was made to provide ESD discharge paths when integrating third party IP in an integrated circuit design for total ESD protection. The Impulse ESD diode has been successfully used with Dolphin Technologies, Artisan/ARM, TriCN/Synopsis I/O libraries, as well as popular IP blocks from RAMBUS, Chip Idea and other quality IP vendors. A 5.5 volt reverse bias anode to cathode operational specification enables the Impulse TSMC .13u ESD diode to be the device of choice for 5 volt tolerant designs.
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ESP8266 WiFi With Headers
Feather HUZZAH
Flagship development board from Adafruit, and like its namesake it is thin, light, and lets you fly! We designed Feather to be a new standard for portable microcontroller cores. This is the Assembled Adafruit Feather HUZZAH ESP8266 with headers. At the Feather HUZZAH's heart is an ESP8266 WiFi microcontroller clocked at 80 MHz and at 3.3V logic. This microcontroller contains a Tensilica chip core as well as a full WiFi stack. You can program the microcontroller using the Arduino IDE for an easy-to-run Internet of Things core.
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100 High Speed Programmer
Commander Accelerator
The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
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Clock Generation Devices
Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Chip Inductors
Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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ARM LPC2364 Board
MS 1541
- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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Anti-Surge Chip Resistors (Double-Sided Resistive)
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Socket with Collet Contacts
Correct-A-Chip
Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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On-Off Controllers
The STM6600 and STM6601 smart push-button on/off controller chips offer protection for battery-operated devices in many ways. These include minimizing the risk of powering up without sufficient battery energy to complete the sequence, which can damage the system. It can also prevent power-up if it detects a fault in the power supply.
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Pressure Sensors
ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Data Loggers
Premier Electrosystems has a wide range of data loggers to suit your needs. All our data loggers can be customized as per requirement. Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it. Then the information stored in the data logger is transferred to a computer for analysis.
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Machine With A History
PAS 5500
In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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2.5G DFB Laser Diode Chips
Guilin GLsun Science and Tech Group Co., LTD
2.5G DFB Laser Diode Chips by GLSN
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Multilayer PCB
ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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16 Channel Multihit TDC
VX1290N-2eSST
The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Diode Arrays
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
