Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- TEAM SOLUTIONS, INC.
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GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
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SparkFun Analog/Digital MUX Breakout
CD74HC4067
This is a breakout board for the very handy 16-Channel Analog/Digital Multiplexer/Demultiplexer CD74HC4067. This chip is like a rotary switch - it internally routes the common pin (COM in the schematic, SIG on the board) to one of 16 channel pins (CHANxx). It works with both digital and analog signals (the voltage can't be higher than VCC), and the connections function in either direction. To control it, connect 4 digital outputs to the chip's address select pins (S0-S3), and send it the binary address of the channel you want (see the datasheet for details). This allows you to connect up to 16 sensors to your system using only 5 pins!
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SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic con...show more -
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High Performance EV Battery Test System
Shenzhen Sinexcel RE Equipment CO., Ltd
The 6V series battery test system uses a full-bridge circuit topology with a higher digit sampling chip. It can provide higher precision and more dynamic test data, and can provide a complete test program for mainstream lithium-ion batteries and batteries with a variety of material systems such as sodium batteries.
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IR Sensor
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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In-chip Monitoring Solutions
Range of in-chip monitoring and embedded sensing fabrics allows for meaningful data to be captured at each stage of a chip’s lifecycle. Manufacture | Wafer Sort | Package Test | In-field | End-of-lifeDeep in-chip sensing, telemetry & analytics enablement. Highly distributed, real-time thermal analysis. Supply voltage sensing for power optimisation. Chip assessment for chip to product appropriation.
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Capacitors - Binary Chip
Macom Technology Solutions Holdings Inc.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
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Module Spectrum
nRF52810 Series
Nordic nRF52810 solutioin features an Arm Cortex-M4 processor with 192 KB Flash and 24 KB RAM with 32 GPIO available. Supports SPI, UART, I2C, PWM interfaces with both Chip Antenna and PCB Antenna option for selection.
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FMC Quad ADC 16-bit @ 1 GSPS and Quad DAC 16-bit @ 2.8 GSPS
FMC231
The FMC231 is an FPGA Mezzanine Carrier (FMC) per VITA 57 specification. The board has quad ADC (the ADC chips are dual channels) and quad DAC (the DAC chip is quad channel). The FMC231 utilizes TI ADS54J60 (option for ADS54J69) providing 16-bit conversion rates of up to 1.0 GSPS and a DAC DAC39J84 providing 16-bit conversion rates of up to 2.8 GSPS.
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SparkFun Cryptographic Co-Processor Breakout
ATECC508A (Qwiic)
The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:
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Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Chip Resistor Array
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Data Loggers
Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it.
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RF modules
Dresden Elektronik Ingenieurtechnik GMBH
2.4 GHz OEM module with chip ceramic antenna based on the ATmega128RFA1 single-chip microcontroller from Atmel
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IPhone Data Recovery Tool
iPhone Jig (several chips)
iPhone and iPad is special with its system.encrypted with several chips;once they get damaged(can't boot or start),it is hardly to get data back.
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Amine Blush Chip Screen Test Kit
Elcometer 139
The presence of amine blush is indicated by a visual change of colour of the test solution when compared with a control sample. The Elcometer 139 determines whether amine blush is or is not present on the coating’s surface.
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Dry Systems
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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PCI Express
PCIe
PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
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Linescan SWIR Camera
LINECAM12
Princeton Infrared Technologies, Inc.
The LineCam12 is an advanced linescan SWIR camera with 14-bit digital data at 37klines/s on USB3 or Camera Link™ outputs. The SWIR camera currently comes in two varieties: 250 μm tall pixels for spectroscopy and 12.5 μm square pixels for machine vision applications. The camera has incredible versatility enabling full wells from 75ke- to 100Me- with 128 steps of variation as well as integration times from 10 µs to 150s. On chip optical pixel binning (where every other detector is disconnected fro...show more -
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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8 Channel DAC FMC Module
DACNF08 – HPC
Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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I2C Isolators
Analog Devices’ family of isolated I2C isolators support a complete isolated I2C interface. This portfolio is based on our iCoupler® chip scale transformer technology. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. By integrating iCoupler channels with semiconductor circuitry, our technology enables a complete, isolated I2C interface with a small form factor. Our I2C isolators covers applications such as central office switching, networking, and power over Ethernet.
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Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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SparkFun Dev Board
ESP8266 Thing
This is the SparkFun ESP8266 Thing Dev Board – a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective, and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors, or automate coffee makers, and with an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any Internet-connected project. To top it all off, the ...show more -
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Smart Sockets
Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the e...show more -
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Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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3U Processor Board
CP32001
LinkedHope Intelligent Technologies Co.,Ltd.
CP32001 is designed based on the second generation Intel® Atom™ processor and D525, D455,.The processor has the advantages of low power consumption, high performance and other characteristics and also equipped with high performance Southbridge chips: the Intel® I / O Controller Hub 82801HBM (ICH8M).CP32001 memory controller supports up to 4 GB of DDR3 memory (2x 2GB).The maximum resolution of VGA display core is 2048x1536.CP32001 is a small PC, integrates many common interfaces, for example: USB, Gigabit Ethernet. SATA II and COM, and also equipped with high-performance sound card interface.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks perf...show more
