Showing results: 181 - 195 of 418 items found.
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FilmTek 2000 PAR -
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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T300 ButtonTile™ -
Celadon
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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AX2600 And AX2700 -
MKS Instruments
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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WCT-120 -
Sinton Instruments
Best available lifetime measurement accuracy. Measure lifetime and surface recombination for a wafer of any quality or crystallinity.
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MTI Instruments
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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YieldStar -
ASML
Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Integrated Metrology Family -
Nova Measuring Instruments Inc.
Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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CSE Co.,Ltd
* Resistor Calibration Substrate * Mili Ohm ~ Giga Ohm * Wafer type size 6, 8, 12 inch.
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Precision Micro Diamond Scriber MR200 -
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Get Control, Inc.
AMHS and conveyor manufacturers utilize the Tri-Axial Vibration Test Tool to quantify and qualify the vibration characteristics during development, installation and maintenance of their systems. This industry-standard tool is used by 200mm and 300mm FABs to measure the vibration induced to wafer lots by their material handling systems. By detecting the early signs of track misalignment, systems can be maintained to minimize the vibration induced on the wafer lots.
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Amkor Technology, Inc.
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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EVG®20 -
EV Group
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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UNIVANS Co., Ltd.
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Yamashita Denso Corp.
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible