Showing results: 76 - 90 of 434 items found.
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STI3000 -
Solidus Technologies, Inc.
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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INSPECTRA® IR Series -
Toray Engineering Co., Ltd.
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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WeiMin Industrial Co., Ltd.
Electrical Testing: Forward:VF,DVF,VFDReverse:VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Tokyo Seimitsu Co., Ltd.
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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EVTMHS -
Genmark Automation
The EVTMHS is a wafer handling system with extended vertical travel designed to transport 300mm and 450mm wafers in semiconductor manufacturing tools that require large work envelope solutions.The system can also handle 200mm wafers without any hardware changes. While for wafer sizes below 200mm, the robot End-Effector has to be reconfigured. The time that this reconfiguration takes is usually less than an hour including the time needed to teach all the pickup positions. Thus, the average teaching time of 45 minutes (for pickup locations) can be achieved thanks to the sophisticated autoteach routines provided by the system firmware.
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ILS-W2 -
BT Imaging Pty Ltd
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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EagleView -
Microtronic, Inc.
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Probing Solutions, Inc.
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Alto Inspection Corp.
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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GR-300 Series -
HORIBA, Ltd.
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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MicroINSPECT -
Microtronic, Inc.
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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MX 30x -
E+H Metrology GmbH
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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NorCom 2020-WL -
NorCom Systems Inc.
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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WCT-120PL -
Sinton Instruments
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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E3310 -
Advantest Corp.
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.