Showing results: 256 - 270 of 434 items found.
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HS-MRTT -
HenergySolar
Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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Renesas Electronics Corp.
Renesas insulated-gate bipolar transistors (IGBTs) realize both low saturation voltage and fast switching through thin wafer technology. Product series suitable for a variety of applications are available, and help to cut down all kinds of power loss.
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EV Group
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.
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Model 2012AF & 2012SM -
OAI
The Model 2012AF Flood Exposure System provides a cost-effective method for automated flood exposure. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.The Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
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EV Group
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Camtek Intelligent Imaging
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Recif Technologies Inc.
The NFE200 is a single stage tool that aligns wafers by the notch and elevates them for inspection by the Operator.Wafers are aligned using the heavily industrialised alignment technology developed by RECIF Technologies and used in the field for 10+ years. The final position can be selected through the User Interface.
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GEN3000T -
Toray Engineering Co., Ltd.
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Minitile™ with Advanced Cantilever™ technology and WedgeTile™ -
Celadon
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Model MPS-2000 -
TEK-VAC INDUSTRIES Inc.
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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Precision Development Consulting Inc
Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol
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OHT Inc.
*This system can measure MRAM characteristics automatically.*Generates strong and constant magnetic fields. (Max 1.5T, the highest in the industry)*Performs high speed sweep of magnetic field by using non-magnetic materials wafer chuck. (Max 4Hz, ±1T, the highest in the industry)
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E3640 -
Advantest Corp.
Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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R2D Automation
ID Reader 8″ is the best tool to avoid lot errors. Designed for using 200mm – 8″ notch aligner and OCR system, it checks your carrier tag, reads each wafer scribes, then sends the information to your Host with SECSII Gem commands
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iS-G1 -
BT Imaging Pty Ltd
The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.