Showing results: 1 - 15 of 301 items found.
-
T5822 -
Advantest Corp.
Wafer-level testing of DRAMs, NAND devices and other non-volatile memories used throughout portable electronic devices. The T5822 is designed to provide manufacturers of multiple memory devices with cost efficiency and optimal functionality, including full test coverage of as many as 1,536 devices in parallel with data transfer rates up to 1.2 gigabits per second (Gbps).
-
Magnum EPIC -
Teradyne, Inc.
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
-
Teradyne, Inc.
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
-
UniTest Inc.
The application tester tests the memory devices such as graphic memory and HDD buffer memory in a specially designed condition made similar to actual PC and Server environments. In fact the graphic memory has releatively higher speed, test expense and quality standard compared to main memory, stressing the importance and the need of the application tester.
-
NTS3700 Series -
Novtek Test Systems
FLASH memory endurance cycling systems are used to characterize and qualify the write/erase cycling endurance of FLASH memory devices, and to conduct functional testing of memory devices at extreme temperatures. A typical system consists of an environmental chamber, algorithmic pattern generator, programmable power supplies and system controller.Novtek’s systems can accommodate from 64 to 864 devices for parallel devices and . In addition to FLASH, the systems can also accommodate MRAM, EEPROM, EPROM, PROM (OUM), Mask ROM, SRAM, FeRAM, DRAM, PC Cards (PCMCIA), embedded FLASH microcontrollers and NVM based FPGA. The system's environmental chamber has a range of -55oC to +200oC and is ideal for temperature characterization of memory based devices and packages.
-
Teledyne LeCroy
Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
-
Renesas Electronics Corp.
Renesas offers MIL-STD-883-compliant CMOS random access memory (RAM) and CMOS programmable read-only memory (PROM) devices that are that are qualified to QML Class Q military standards.
-
ShibaSoku Co., Ltd.
Power device or module with which are digitally controlled and memory can be measured per system.
-
T5833/T5833ES -
Advantest Corp.
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
-
T5830 -
Advantest Corp.
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
-
Arduino MKR Mem Shield -
Arduino llc
Are you developing a complex IoT device with your MKR board and running out of memory? Add Flash memory and microSD storage to your MKR board, and allow over-the-air updates, with the Arduino MKR MEM Shield.
-
MS7208 -
MiNT Systems Corporation
The MS7208 system can test a wide range of device families including – but not limited to – NAND flash, NOR flash, multi-level flash, multi-die flash, EEPROM, RAM, and mixed-technology memory devices.
-
Meco Instruments Pvt. Ltd.,
Memory & Read FunctionRight Device to know the TRUE -LIFE of Battery Capacity (Resistive / Voltage) Simultaneously MeasureOn - Line Testing without shutting down batteryBuilt - in Comparator FunctionRates Conditions as PASS, WARNING or FAILDatalogging Memory FunctionCompact and lightweightRS-232 Interface & SoftwareAuto Power Off
-
Campbell Scientific, Inc.
External data storage devices can be used for redundant data storage, additional data storage, or convenient data retrieval from the field. These devices use a variety of technologies, including USB, flash memory, CompactFlash, and microSD.
-
Accurate Technologies Inc.
ECU Interfaces are devices that connect to an ECU microcontroller directly as a memory emulator or through the debug port interface. The interface is typically through a direct replacement of the microcontroller, memory emulation, or through the debugger port. The method can be driven by what is supported on the microcontroller. ATI offerings support all approaches:
