MPI Probe Card Technology

MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

  • +886-3-5551771
  • +886-3-555-2882
  • pcsales@mpi-corporation.com
  • No. 155, Chungho St.,
    Chupei,
    Hsinchu, 302
    Taiwan

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Showing results: 1 - 3 of 3 items found.

  • Osprey Probe Card

    MPI Probe Card Technology

    The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design.  The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.

  • Cantilever Probe Card

    MPI Probe Card Technology

    MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fi­ne pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.

  • FCB Probe Card

    MPI Probe Card Technology

    The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.

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