Memory Device
directly accessible computer's internal or main memory.
See Also: Memory, Memory Test, DDR, NAND, DRAM, RAM, ROM, Memory Testers, DUT
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Product
COM/SOM Modules
PicoZed Family
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Computer on Modules and System on Modules are complete embedded computers with a computer processor, chipset, memory, and peripherals designed into a single board with a small footprint. They integrate the complete functions of a computer in to a single module. Both COMs and SOMs are types of single board computers except the fact that both of these are required to be mounted on a carrier board/base board which breaks the bus out to standard peripheral connectors as COM/SOM lacks the standard connectors for any input/output peripherals to be attached directly to the board. Carrier boards can implement special I/O interfaces, additional memory devices, and connectors according to the application requirements. COM examples include COM-Express Basic, COM-Express Compact, COM-Express Mini, QSeven, ETX etc. SOM examples are NOVSOM, MitySOM, and SOM CM7120 etc.
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Product
Pulse Concentrator
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1) Total counter indexes of 12 pulse inputs with tariff and unit information, date and time information and alarm states can be displayed on the 2x12 characters LCD screen automatically with intervals of 5 seconds or manually by pressing up and down buttons,2) Enabling the backlight for 20 seconds by pressing any button to provide easy reading on the screen,3) Data communication with a PC via RS-485 output,4) Storing the contents of each pulse input with tariff information in 1-60 minutes intervals on the 2 MB permanent memory of the device with date and timeinformation,5) Preventing changes to settings by unauthorized users by defining a 4-digit user password.
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Product
Memory Test System
T5833/T5833ES
Test System
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Product
Flash Memory Test System
T5830
Test System
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Product
Surface & Volume Resistivity Meter for Nonconductive Materials
Hiresta UX
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The new Hiresta-UX is a high performance meter for measuring the surface and volume resistivity of a wide variety of nonconductive materials. With an extended measurement range of 103 ~ 1014Ω, this meter is ideal for Production, Engineering, R&D and Quality Control. The new Hiresta-UX features powerful new algorithms that automatically choose the right voltage, which optimizes the surface and volume resistivity testing. This versatile, high performance resistivity meter includes a built-in switch box that can be mated with a J-Box (meets JIS K 6911 for surface & volume resistivity and is compatible with ASTM D 257) as an option. The Hiresta-UX can store up to 2,000 measurement results, which can be easily exported to a USB memory device.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V32GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Dynamic Power Device Analyzer/Double Pulse Tester
PD1500A
Power Device Analyzer
As an off-the-shelf measurement solution, the PD1500A delivers reliable, repeatable measurements of wide-bandgap semiconductors. The platform ensures user safety and protection of the system’s measurement hardware.
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Product
Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
Dual In-Line Memory Module (DIMM)
DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
USRP‑2930, 20 MHz Bandwidth, 50 MHz to 2.2 GHz, Included GPS-Disciplined OCXO, USRP Software Defined Radio Device
781910-01
Software Defined Radio Device
20 MHz Bandwidth, 50 MHz to 2.2 GHz, Included GPS-Disciplined OCXO, USRP Software Defined Radio Device - The USRP‑2930 is a tunable RF transceiver with a high-speed analog‑to‑digital converter and digital‑to‑analog converter for streaming baseband I and Q signals to a host PC over 1 Gigabit Ethernet. It also features a GPS-disciplined oscillator (GPSDO) with PPS accuracy of ±50 ns. You also can use the NI USRP‑2930 for the following communications applications: white space; broadcast FM; public safety; land-mobile, low-power unlicensed devices on industrial, scientific, and medical (ISM) bands; sensor networks; cell phone; amateur radio; or GPS.
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Product
USRP Software Defined Radio Device
Software Defined Radio Device
The USRP Software Defined Radio Device is a reconfigurable RF device that includes a combination of host-based processors, FPGAs, and RF front ends. The USRP Software Defined Radio Device include options that range from lower cost options with fixed FPGA personalities to high-end radios with a large, open FPGAs and wide instantaneous bandwidth. These devices can be used for applications such as multiple input, multiple output (MIMO) and LTE/WiFi testbeds, SIGINT, and radar systems.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
USRP-2954, 10 MHz to 6 GHz, GPS-Disciplined OCXO, Reconfigurable USRP Software Defined Radio Device
783153-01
Software Defined Radio Device
The USRP-2954 provides an integrated hardware and software solution for rapidly prototyping high-performance wireless communication systems. Built on the LabVIEW reconfigurable I/O (RIO) architecture, USRP RIO delivers an integrated hardware and software solution, so researchers can prototype faster and shorten time to results. You can prototype a range of advanced research applications that include multiple input, multiple output (MIMO); synchronization of heterogeneous networks; LTE relaying; RF compressive sampling; spectrum sensing; cognitive radio; beamforming; and direction finding. The USRP-2954 is equipped with a GPS-disciplined 10 MHz oven-controlled crystal oscillator (OCXO) reference clock. The GPS disciplining delivers improved frequency accuracy and synchronization capabilities.
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Product
USRP-2955, 10 MHz to 6 GHz, 80 MHz Bandwidth, GPS-Disciplined OCXO, Reconfigurable USRP Software Defined Radio Device
785264-01
Software Defined Radio Device
The USRP-2955 provides an integrated hardware and software solution for rapidly prototyping high-performance wireless receiver systems. It is designed for over-the-air signal acquisition and analysis. It features a two-stage superheterodyne architecture with four independent receiver channels and shares local oscillators for phase-coherent operation. It also offers a Kintex-7 FPGA programmable with the LabVIEW FPGA Module. With these features, the USRP-2955 has the RF and processing performance for applications such as spectrum monitoring, direction finding, signals intelligence, wideband recording, and radar prototyping. The USRP-2955 is equipped with a GPS-disciplined 10 MHz oven-controlled crystal oscillator (OCXO) Reference Clock, which improves frequency accuracy and synchronization.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Reflective Memory
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An innovative solution designed to provide highly deterministic data communications for your real time applications such as distributed simulation.
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Product
Industrial Memory
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Advantech SQRAM Industrial Memory solutions offer an extensive portfolio of industrial grade DRAM solutions, such as UDIMM, SODIMM, ECC-DIMM, RDIMM, and LRDIMM designed according to the JEDEC standards and cover all technologies including DDR, DDR2, DDR3, DDR4 in wide temp ranges (-40 to 85°C).
