Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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4-Probe Resistivity and Resistance Tester
HS-MPRT-5
t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Resister Blackjack
Resistor blackjack is like regular blackjack but better! Your goal is to assemble a single resistance from several resistors that is as close to 21k while not being over.Unlike regular blackjack, the resistors can be combined in series and in parallel, giving the game a whole new dimension. Plus, resistors have tolerances so achieving a mathematical 21k doesn't guarantee a win.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Resistance Tester
KT-2000RD
This equipment represents the wanted resistance value in digital figures and at the same time, is an ohmmeter which decides products to be bad in case of being out of the previously set range of H,L and to be good in case of being within the range. Moreover, because it is designed and manufactured on the basis of KAST's business experiences and know-hows accumulated through on-the-spot works for a long time, it is highly trustable, especially strong to noise and impulse that occur on the bad electric condition of on-the-spot or on the connection with any other equipments, and also is convenient for use.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Resistance Meter
MT16-4L
М-module МТ16-4Л is a mezzanine module (hereinafter referred to as a mezzanine), designed to measure the resistance of resistive sensors using a four-wire measurement circuit in sixteen channels (sixteen-channel digitizer). М-module МТ16-4Л is installed on the mezzanine carrier - module НМ-М and is connected to it via a local information highway. Up to four mezzanines of various types can be installed on the NM-M module. The NM-M module, together with the mezzanines installed on it, forms a VXI module of the C-1 size and is used to create information measuring VXI systems.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Resistance Calibration
Process Instruments maintains fractional part-per-million accuracy with a state of the art resistance calibration facility. Specialized services include precision resistor manufacture, resistor and shunt repair, characterization of alpha and beta temperature coefficients and the determination of barometric effects on resistance values.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Insulation Resistance Testers
Shanghai Beha Electronics Co., Ltd.
*This is a variable high voltage insulation tester from 500V to 15kV in 500V steps.*The is menu driven and uses Dynamic Current Auto ranging technology.*It has a Bar-Graph which displays the voltage stressing the insulation while the test is in progress and the voltage decay during the automatic discharge of the tested circuit.*The top line of the display shows the elapsed time at the start of the test. Digital readout of the total time will remain displayed even after testing has ceased.*A 4-digit display (2000 counts) is showing the actual insulation resistance.*This instrument displays a voltage warning and sounds when AC or DC is present before injecting the test voltage.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Resistance Welding
Resistance welding is a method in which the welding works are heated by resistance heat generated by sandwiching the welding workpieces with welding electrodes, passing current through them, and the metal is welded while pressurizing the works.A resistance welding machine composed of welding power supply, a weld head and an electrode. The welding power supply controls a welding current,the weld head exerts a pressure on the material to weld and the electrode provides welding current and pressurization force to the part under welding. We have been providing various kinds of welding power supplies and welding heads to meet these requirements.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Electronic Store Of Resistances
PS8
The module is intended for use as part of information measuring systems based on the VXI bus for software setting of resistance values with a given step along three independent channels.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
