Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
Fanless Network Appliance For Edge Deployment With 5G And Wi-Fi6. Ideal For Edge Computing And 5G Network Infrastructure.
FWA-1212VC
-
Intel Atom® C3336/C3558 network SoC with Intel® QuickAssist Technology1 x DDR4 2133/2400MHz, SODIMM (ECC optional) up to 16GB2 x 1GbE SFP/RJ-45 combo ports (auto-negotiation) + 4 x 1GbE RJ-45 LAN portsReserve 1 x M.2 3052/3042 / 1 x M.2 2230 and 1 x Mini-PCIe for RF module selectionDefault 16GB eMMC onboard
-
Product
Wafer Prober
Prexa MS
-
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
-
Product
Edge Card Adapter, Universal, for .093 PCB
111107148
-
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
-
Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
-
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
-
Product
Intel® Processor N97 IoT Edge Computer With 4x LAN, 6x COM, 4x USB, 1x HDMI, And 1x VGA.
UNO-247 V2
-
Intel® Processor N97Flexible iDoor expansion design with sufficient IO port4 x GbE, 2 x USB3.2, 2 x USB2.0, 2 x RS232/422/485, 4 x RS485, 1 x HDMI, 1 x VGA, 2 x GPIOCompact size with fanless designOptional 4G/GPS/GPRS/Wi-Fi communicationTerminal block for wiring capabilityOptimized mechanical design for easier RAM swappingSupport Win11 IoT and Ubuntu 22.04
-
Product
Edge AI Platforms
-
ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
-
Product
MultiSite Test sockets and Wafer Level
-
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.






