Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
Intel® Movidius™ Myriad™-Based Industrial AI Smart Camera for the Edge
NEON-1000-MDX Series
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ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
MEC Server
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Signage & Edge Computers UBX Zero Series
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Compact ARM-based edge computer with full Google Mobile Services, security updates, and device management for smart retail and kiosks.
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
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- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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Product
Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Product
360° Edge Analytics
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360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
Platform
- Deep learning acceleration with Jetson Xavier™ NX- Compact fanless system 148(W)x120(D)x49.1(H)mm*- Wide temperature range from -20°C to 70°C
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
4U Edge AI HPC
AIR-520
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4U Edge AI HPC powered by AMD EPYC 7003 series processor and NVIDIA Certified with RTX™ 6000 Ada Generation. Server grade perofmance powered by AMD EPYC 7003 processor. NVIDIA Certified with RTX™ 6000 Ada Generation graphic card.
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Product
1U OTII-Compliant Edge Server
SKY-7120S
Server Board
1U OTII-compliant edge server with Intel® Xeon® D-2100 CPU. Short-depth, front I/O, and wide temp design for 5G vRAN and mission-critical telecom.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
04 With Pins For PCB | 1 Wafer | 24 Positions
04-1xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge
NEON-2000-JT2 Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
