Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Laser Type Edge Detection Sensor
LD
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Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Edge AI SDK
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A ready-to-use toolkit for efficient LLM tuning, smooth deployment, and scalable edge AI management, built for reliability and rapid innovation.
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Product
2U Edge Server With 5th/4th Gen Intel
SKY-820V3
Server Board
2U edge server with 5th/4th Gen Intel® Xeon® Scalable processors, ideal for AI training, inference, and high-performance edge computing.
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
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*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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Product
Automated Control System for Veneer Edge Gluing Line
Vikat
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The automated veneer splicing line control system is designed to identify defective veneer areas, control the scrap trimming, bonding of suitable areas and the formation of output sheets of a given size.
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Product
The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
System
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Edge Gateway
UBC-330
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UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
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Product
PCIe X4 With 4x/8x Intel® Movidius™ Myriad™ X VPU Edge AI Acceleration Module
VEGA-340
Acceleration Module
Four/Eight Intel® Movidius™ Myriad™ X VPU onboard. Hardware acceleration for common deep neural networks. Scalable for multiple video streams edge inference. 10 times the performance compared to the previous generation.
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Product
4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Jetson TX2 NX™ Edge AI Inference Platform
DLAP-211-JT2
Platform
- Deep learning acceleration with NVIDIA® Jetson™ TX2 NX- Linux® Ubuntu operating system- Support wide operating temperature- Compact, durable and fanless design for 24/7 operation- Wide variety of industrial I/O ports and visual inferencing capabilities- Available with AWS IoT Greengrass service and Allxon remote device management
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Product
Fanless Edge AI PC
EPC-R7300
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An industrial Fanless Edge AI PC for the NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano systems-on-modules delivers 20–100 TOPS of AI performance.
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
Save A Watt® Edge
P4170
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The devices that are essential to modern life are numerous, so who can keep track of what has been left on or turned off? This can cause an unwanted surprise when you receive your inflated electricity bill. Make sure the devices that are costing you the most are always in, “real” off mode with the Save A Watt® Edge.
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Product
4U 4GPU High Performance Edge Server With Dual AMD EPYC 9004/9005 Processors
SKY-641E3
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Support all AMD EPYC 9004/9005 family CPU up to 400W TDP24x DDR5 5600Mhz RDIMMSupport PCIe Switch Backplane, Up to 10 FHFL x16, 4 FHHL x8 PCIe Gen48 2.5" NVMe and 2 M.2 2280 NVMe SSD support1 OCP 3.0 PCIe Gen5 x16 NIC support
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Product
Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
Box PC
Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
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Compact 2U Edge Server
SKY-821E3
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Compact 2U edge server with dual AMD® EPYC™ 9005/9004 processors, optimized for virtualization, HCI, and edge analytics.
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Compact Size Mid Tower GPU Server AMD® EPYC™ 8004 Series Processor For Edge AI Inference, Industrial Automation, And Compact GPU Workloads.
SKY-602E3
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Processor: Single AMD® EPYC™8004 Series Server ProcessorMemory: 6 x DDR5-4800 MHz ECC RDIMM, up to 576GBRemote Management: IPMI function supportExpansion: Supports 4 x PCIe x16 double-deck FH/10.5" cards or 2 x PCIe x16 double deck FH/10.5" cards + 4 x PCIe x8 single deck FH/10.5" cardsPSU: 800 Watt 1+1 redundant power supply with 80+ platinum level certification
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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IoT Edge Computer With Intel® Celeron® J3455
UNO-247
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Intel® Celeron® J3455 processorRobust design with high stability2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGACompact size with fanless designRubber stopper design for stand mount and optional kit for DIN-rail mountThreaded DC Jack design for more steady power supplyOptimized mechanical design for easier RAM swapping
