Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Network analyzers are used to measure so-called scatter parameters (S-parameters). These describe the behaviour of electrical components with the help of wave magnitudes. Whether simple cables, filters, amplifiers or complex subsystems, the following applies to all these components: Different loads can have unseen effects on the measured values over time.
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Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Metrology Systems
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High-precision, wavefront-based tools for measuring and testing optical components, specializing in Shack-Hartmann sensor technology.
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Particle Metrology System
Archimedes
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Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Photovoltaic/Solar Metrology System
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Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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High Accuracy Dimensional Metrology System
Pinnacle 250
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The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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Automated Metrology
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KLA Instruments automated metrology instruments enable fab process control to quantify electrical properties, material deposited/removed, surface topography/roughness and critical dimensions. Automated metrology options include optical profilometry, stylus profilometry and film thickness mapping.
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Metrology Device
XPLOR 100
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XPLOR 100 is a state of the art, fully automated metrology device designed for measurement and analysis of bubbles and inclusions for optical substrates in the Visible and NIR wave-bands.
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INnLline Metrology Automated & Robotized Solutions
Automation projects
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Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
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Thermal Warpage Metrology Tool
AXP 2.0
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The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Scatterometers / Thin film Metrology Systems
Olympian Series
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DUV-Vis-IR (Wavelength Range: 190nm – 15,000nm) Scatterometers / Thin Film Metrology Systems: The n&k Olympian, n&k Olympian-450 and n&k Olympian-M are DUV-Vis-IR scatterometers/thin film metrology systems with micro-spot technology, covering the wavelength range from 190nm – 15,000nm. With the inclusion of the infra-red wavelength range, the Olympian Series extends the capabilities of n&k’s DUV-Vis-NIR scatterometer series – the OptiPrime-CD Series.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Dimensional Metrology
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Nova offers in-line optical integrated and stand-alone metrology platforms. The metrology product portfolio, combined with our modeling algorithm software, delivers unique measurement capabilities for the most advanced semiconductor technology nodes.
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Compact General-Purpose Metrology System
Benchmark 250
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The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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Metrology System
IMPULSE V
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With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Process XRR, XRF, and XRD metrology FAB tool
MFM310
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Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Benchtop Metrology System
FilmTek 2000 SE
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Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Portable Metrology‑Grade 3D Scanner
Black Series
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The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Dimensional Metrology
Integrated Metrology Family
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Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Semi-automated Metrology System
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Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Metrology
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Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Thin Film Metrology Systems
Gemini Series
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The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
