Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Metrology System
IVS
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Coupler Metrology
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Rosenberger provides directional coupler-based measurement techniques as well as probes for comprehensive cross-domain coupling analysis.Nowadays, the introduction of new accessories within vehicles, like rear seat infotainment, smart dashboards, and various advanced driver assistance systems, has increased the demand for high-speed automotive bus systems working in parallel with the high-voltage power networks in electric cars.
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Materials Metrology
VeraFlex Family
World-class XPS and XRF metrology technologies for semiconductor process control.
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Thermal Warpage Metrology Tool
AXP 2.0
The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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INnLline Metrology Automated & Robotized Solutions
Automation projects
Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
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Metrology System
IMPULSE V
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Vision Metrology System
NGS 3500Z
This bench top lower cost, yet high performance system is designed for applications where defect detection and precisionmeasurements on wafers and other parts (up to 200 mm) are required. It is well suited for use as a dedicated productiontool or as a versatile process development system. It features a powerful set of automated as well as semi-automaticoptical/ video tools optimized for high accuracy, production throughput, and ease of use.This automated and versatile platform features a standard Nikon/ Olympus bright/ dark field microscope with optionalNomarski, and precise part staging. This system offers significant and unique advantages for dual production/ engineeringuse, and provides the perfect solution when both defect detection and dimensional metrology are required.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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Metrology Software
ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Thin Film Metrology Systems
Gemini Series
The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Metrology
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Network analyzers are used to measure so-called scatter parameters (S-parameters). These describe the behaviour of electrical components with the help of wave magnitudes. Whether simple cables, filters, amplifiers or complex subsystems, the following applies to all these components: Different loads can have unseen effects on the measured values over time.
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Rotational Metrology System
The ZeroTouch® Rotational Metrology System is a precise, high-speed, in-line or near-line metrology, and inspection system that measures critical dimensions of rotors, stators, brake discs, and other cylindrical parts, providing manufacturers with real-time metrology, and inspection data to optimize production processes, detect defects, and improve ROI.
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Digital Readouts & Metrology Tools
HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Scatterometers/ Thin Film Metrology Systems
LittleFoot Series
The n&k LittleFoot-CD, and LittleFoot-CD450 are DUV-Vis-NIR scatterometers/thin film metrology systems, based on polarized reflectance measurements (Rs and Rp) from 190nm to 1000nm, with microspot technology. The systems in the LittleFoot-CD Series determine thickness, n and k spectra from 190nm-1000nm of thin films, as well as depths, CDs, and profiles of trenches and contact holes.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Quantum & Metrology Instruments
Beyond quantum sensors, Exail’s photonics solutions enable real applications in other quantum technology fields. They also enable precise control and transmission of the frequency, phase and amplitude of a laser light through fibered telecommunication links, for metrology applications. The true and deep understanding of Exail teams for the fundamental physics behind its technology explains the absolute quality of its time & frequency reference products.
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3D Metrology Solutions
SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Metrology
Berliner Glas KGaA Herbert Kubatz GmbH & Co.
We make use of extensive measurement techniques and develop individual measurement setups in order to ensure that our optical components, assemblies and systems comply with your specifications. We create own software to measure customer-specific parameters.
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Gear Metrology System
The Gear Metrology System is a non-contact gear inspection system that generates a 3D point cloud, providing manufacturers with real-time metrology and inspection data to optimize production processes, and improve ROI.
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High-Speed & High-Precision Alignment for Display Metrology
LMK Position
TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Process XRR, XRF, and XRD metrology FAB tool
MFM310
Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Metrology
SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Metrology Search Engine
Qualer Search
Qualer Search is the first metrology search engine that enables you to find potential partners based on services provided and their location.





























