Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology Device
XPLOR 100
XPLOR 100 is a state of the art, fully automated metrology device designed for measurement and analysis of bubbles and inclusions for optical substrates in the Visible and NIR wave-bands.
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Materials Metrology
VeraFlex Family
World-class XPS and XRF metrology technologies for semiconductor process control.
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Dimensional Metrology
Integrated Metrology Family
Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Advanced Metrology System
AMS Series
Precision systems for accurate measurement and quality control in semiconductor manufacturing.
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Quantum & Metrology Instruments
Beyond quantum sensors, Exail’s photonics solutions enable real applications in other quantum technology fields. They also enable precise control and transmission of the frequency, phase and amplitude of a laser light through fibered telecommunication links, for metrology applications. The true and deep understanding of Exail teams for the fundamental physics behind its technology explains the absolute quality of its time & frequency reference products.
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Metrology System
IVS
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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High Accuracy Dimensional Metrology System
Pinnacle 250
The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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Thermal Warpage Metrology Tool
AXP 2.0
The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Metrology Systems
Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Metrology System
Atlas V
The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
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Thin Film Metrology Systems
Gemini Series
The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Linear Metrology System
The ZeroTouch® Linear Metrology System is a high-speed, non-contact linear inspection system ideal for measuring linear-shaped parts such as hip stems and aerospace blades faster than traditional methods.
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Semi-automated Metrology System
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Advanced Metrology System
NGS 3500L
This top performance system is designed for applications where high-speed defect detection and precision measurements on wafers and other parts are required. It is well suited for use as a dedicated production tool or as a versatile processdevelopment system. It features a powerful set of automated as well as semi-automatic optical/ video tools optimized for high accuracy, production throughput, and ease of use.
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Benchtop Models For Best Film Metrology
Fixed, high-precision laboratory instruments used to accurately measure properties like film thickness, refractive index, and roughness.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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High-Speed & High-Precision Alignment for Display Metrology
LMK Position
TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Optical Metrology
YieldStar
Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Metrology
Rosenberger Hochfrequenztechnik GmbH & Co. KG
Network analyzers are used to measure so-called scatter parameters (S-parameters). These describe the behaviour of electrical components with the help of wave magnitudes. Whether simple cables, filters, amplifiers or complex subsystems, the following applies to all these components: Different loads can have unseen effects on the measured values over time.
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Particle Metrology System
Archimedes
Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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Optical Metrology
Complex measurements can be performed quickly and easily with optical measuring solutions from ZEISS. With a high degree of automation and state-of-the-art sensors, they reduce operating errors and guarantee high measuring accuracy.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Scatterometers / Thin Film Metrology Systems
OptiPrime Series
The n&k OptiPrime series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.
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Manual Semiconductor Metrology System
Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Metrology System
Aspect
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
