BGA Inspection
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Product
Inspection Microscope
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This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
Compact Inspection Camera
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Fits in your pocket or clips on your beltAffordable1 meter drop-proofLong, thin camera-tipped probe with excellent depth of field penetrates tight, hard-to-reach spacesProbe is waterproof, holds its configured shape, and coils inside clamshell case for storageFour camera-lighting LEDs produce bright, crisp video on large color LCDFour screen controlsFour useful probe tip accessories (pickup hook, magnetic pickup, 45 mirror, thread protector)
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Product
GoPxL Inspection Software
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GoPxL® is our next generation software application for creating end-to-end, web-based inline measurement and inspection solutions deployed on Gocator® 3D Smart Sensors and Gocator® 2D Smart Cameras.
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Product
Automatic Flight Inspection System
AT-950
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The AT-950 is the easiest to use and the fastet performing FIS available.
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Product
Inspection Tools
Multi Disk Test System (4-Port)
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16 types of inspection modes can be registered and edited. More accurate acceptance inspections can be performed using various types of inspections.High speed data communications using USB interface for communicating with host computer.Acceleration testing for temperature loaded HDD can also be performed. (Optional)Easy attaching and removing HDD using optional plug-in unit.
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Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Product
Visual Visual Inspection Device
IP-3000
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Our visual visual inspection device Inspection Pro IP-3000 is an inspection device that quickly and accurately inspects the mounting board, which is constantly evolving, and judge whether it is good or bad without omission.
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Product
First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Product
Lithium Battery Inspection Tester
C19
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Fuzhou Fuguang Electronics Co., Ltd.
C19 series is a portable tester which can quickly inspect battery pack of two-wheel vehicles. It can realize quick inspection and selection of SOH data of battery pack and discharge-charge maintenance. Data can be transferred to the mobile phone APP through Bluetooth forming a statistics report and faulty cell warnings so that further maintenance solutions can be developed in time.
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Product
LED Inspection
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Indicates which LEDs are not working. Checks if all diodes are placed in the correct places. Independently configures a test program for each new LED panel. Fast and effective – 1000 LED panel test takes up to 3 seconds.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Product
Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Product
Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Product
Automated Optical Inspection Solutions
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Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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Product
Video Inspection Station
VIS300
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
8th Gen Intel® Core™ Processor BGA 1528
AIMB-233
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Supports Intel® Core™ core i7-8665UE /i5-8365UE/I3-8145UE/Celereon 4305UE, 15W TDP, BGA 1528 16nm ProcessorSupports two 260-pin SO-DIMM up to 64GB DDR4 2400 MHz SDRAMSupports multiple display I/O supports versatile Tri display functions for HDMI,Support PCIex1, 2 M.2 (1 F/S miniPCIe), 4 USB 3.1, 2 USB 3.0 and 2 SATA IIISupport wide range 12V~24V DC Input and low profile heightSupports WISE-PasS/RMM and Embedded Software APIsSupport SUSI, WISE-DeviceOn and Edge AI
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Product
Conformal Coating Inspection System
TROI 8800 CI
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The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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Product
Tyre Inspection Systems
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The VLT tyre inspection system can check several tyre and wheel related items, such as tread depth and sideslip. All measurements are done very fast when the vehicle is on the roller brake tester.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
X-Ray Inspection System
MXI Quadra 5
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Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Product
Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Product
TO-CAN Package Inspection System
7925
System
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Product
Inspection Bundle
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Cost effective bundle of eVision's inspection librariesIncludes EasyImage, EasyGauge, EasyMatch, EasyObject and EasyColor
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Product
Video Inspection Scope
BK3000
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• Integrated 8.5 mm high-res imager allows for ease of use and ensures the product is always ready to go. Imager is resistant to dust, dirt, and water ingress for 30 minutes at depths of up to 3 meters.
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Product
Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Product
Printing Quality Inspection Machine
TQM AVI
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Landrex Technologies Co., Ltd.
Printing Quality Inspection Machine
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Product
X-ray Inspection System
NEO-690Z / NEO-890Z
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Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
