BGA Inspection
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Product
Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Product
Tool, Inspection Depth Gauge, Micro Coax, Receiver
910121179
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, Receiver
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Product
Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Inspection Tool
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
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Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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Product
BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Product
BGA Rework Station
PDR IR-E6 Evolution
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The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Product
Appearance Inspection
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We perform quality assurance agency of customers' important products through inspection.
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Product
Ultrasound Inspection
ULTRAPROBE 10,000
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The Ultraprobe 10,000 brings Ultrasound Inspection technology to a whole new level. With this one system, inspectors can perform condition analysis, record sounds, store and manage data.
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Product
Inspection and Maintenance
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Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Compact Inspection Camera
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Fits in your pocket or clips on your beltAffordable1 meter drop-proofLong, thin camera-tipped probe with excellent depth of field penetrates tight, hard-to-reach spacesProbe is waterproof, holds its configured shape, and coils inside clamshell case for storageFour camera-lighting LEDs produce bright, crisp video on large color LCDFour screen controlsFour useful probe tip accessories (pickup hook, magnetic pickup, 45 mirror, thread protector)
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Product
IPC Inspection
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Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
PCB Assembly Inspection
a3Di
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a3Di is a revolutionary new technology designed to provide accurate, repeatable and fast PCB inspection. The cost saving potential to your business is significant, reducing your overall product inspection costs, increasing your product throughput rates and reducing customer returns.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
X-Ray Inspection System
TruView™ Fusion
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The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Product
Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Product
Package Inspection Products
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Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Product
X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
Thickness and Flaw Inspection
OmniScan SX
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Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Product
X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Product
Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Product
Ultrasonic Inspection System
PULD 40
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The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
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Product
Vision Inspection System
Vision Station
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Design and manufacture vision inspection system for SOT, SOD, TO, DPAK, SOIC, TSOP, SSOP, QFN/MLP, ODFN and LED inspection.
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Product
Inspection Class ROV
Phantom® L Series
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THE PHANTOM® L6 IS THE NEWEST IN THE NEXT GENERATION OF PROVEN, RELIABLE UNDERWATER ROBOTICS PIONEERED BY DEEP OCEAN ENGINEERING IN ITS MANUFACTURE OF REMOTELY OPERATED VEHICLES (ROV), BUILT IN THE USA FOR NEARLY FOUR DECADES.
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Product
Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Product
Substrate Inspection Apparatus
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The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
