BGA Inspection
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
-
Product
Can Inspection
-
Whether they are 14oz cans, 28oz cans, 12oz bottles, or some other size or format – they typically all look fine, as they fly by on your production line or sit on pallets ready to go out to customers. The challenge is, most companies have some kind of sealing issue at some point. Tops go on crooked, lids don’t seal, vacuums don’t set right – and it’s nearly impossible to tell by physical or visual inspection.
-
Product
Wide Range Film Inspection
790
-
For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
-
Product
AXI Inspection Systems
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
-
Product
Smart Inspection Station
SiS
-
Smart Inspection Systems LLC was born in 2010 in response to orthopedic manufacturers’ demands for faster inspection than their sister industries. Our signature product, the Smart Inspection Station™ (SiS™), is an automated turnkey inspection solution that yields comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. The SiS™ is custom-configured per the client’s needs, yet versatile enough for simultaneous commissioning on multiple product lines. The product of years of refinement, the SiS™ gives comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. Your SiS™ can be custom-configured according to your needs, but is still versatile enough for simultaneous use on multiple product lines. And best of all, every SiS™ purchase comes with ongoing support from L3I’s expert staff.
-
Product
Wireless Fiber Inspection Probe - WIS 300
-
Shanghai Fibretool Technology Co.,Ltd.
WIS 300 wireless fiber inspection scope is a WIFI/USB dual-use portable digital fiber inspector. With automated PASS/FAIL and fast images focus functionality, and easy pairing to Android™ and Apple© iOS devices, It can quickly check various patch cords and transceivers, display the fiber end face in PC/laptop/ OTDR/Smartphone etc..digital devices with the USB cable or WiFi connection. Under WiFi mode, it can automatically get the image checked and analyzed. Test results can do the pass/fail judges with IEC/IPC criteria. Fiber images and results can be saved on PC and mobile devices in jpg/pdf/excel format for file records. It’s super light and handy to take anywhere anytime for field tests, operation inspections, and lab research.
-
Product
Abrasive & Blast Inspection
-
Blasting parameters: A number of important parameters need to be monitored during the blasting or water jetting process, these include: air pressure (at the nozzle), nozzle diameter, blast media contamination & pH values in order to avoid recontamination of the substrate during blasting.
-
Product
Foreign Matter Inspection Device For FPDs
HS-930
-
By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
-
Product
Universal Paint Inspection Gauge
-
The byko-cut universal is a multi-purpose paint testing instrument that measures paint coating thickness, paint adhesion, and coating hardness.
-
Product
Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
-
Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
-
Product
BGA SMT Adapters
Giga-snaP™
-
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
Product
Robotic Inspection Made Easy
i-Robot
-
The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
-
Product
Complete GPR System for Road Inspection
RoadScan
-
Geophysical Survey Systems, Inc.
The RoadScan™ 30 system provides users with an effective tool for quickly determining pavement layers at high speeds. RoadScan is able to collect data densities not obtainable using other labor-intensive methods commonly used for pavement testing.
-
Product
Wafer Sorter and Inspection
SolarWIS Platform
-
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
-
Product
Inspection Instrument for Indicators
i-Checker
-
The i-Checker is specially designed to calibrate measuring accuracy of dial indicators, dial test indicators, and other electronic comparison gage heads with a stroke of up to 100mm (4").±(0.2+L/100)µm indication accuracy. Directly inspects an indicator with a stroke of up to 100mm (4"). The dial test indicator, bore gage and lever-type inductive head can be inspected with optional accessories. Adjustment of the measurement position is very easily accomplished because of semi-automatic measurement and full automatic measurement functions. Creates and prints out the simple inspection certificate. Saves inspection result as CSV file for reusable inspection result by any kind of software.
-
Product
Waterproof Inspection Cameras
-
waterproof inspection cameras have waterproof probes, General's DCS6XX wet/dry cameras, the DCS600A, DCS605, DCS660A, DCS665 & the DCS665-ART, go one step further because their grips and monitors are also waterproof. This feature, unique in the industry, allows users to inspect toilets and water and sewer lines carrying running water without worrying about dropping and "dunking" the instrument.
-
Product
Battery Inspection
-
We design, develop and manufacture X-ray solutions specifically for battery cells. At Exacom we stand for passion, innovation, out of the box thinking, honesty and reliability, as well as speed and a hands on mentality.
-
Product
Bulkflow X-Ray Inspection System
-
Designed to be integrated into line with optional reject stations, the Bulkflow X-ray System is perfect for loose and free flowing products. Offering a good detection levels on a wide range of contaminants including all metal, bone, glass and dense plastics.
-
Product
Protective Inspection Kit for Hazardous Areas
-
The kit provides all the tools required for the on-site inspection of a coating, including surface profile, dewpoint, relative humidity, both wet and dry film thickness and also adhesive testing.Measurement parameters include:Surface inspectionSurface profileSurface contaminationClimatic conditionsCoating thicknessAdhesion
-
Product
Magnetic Particle Inspection
NDT
-
DCM Tech offers a comprehensive selection of Magnetic Particle Inspection machines for non-destructive testing (NDT). Easily and quickly detect internal and subsurface damage on critical parts. Contact DCM to speak to your regional Technical Specialist about adding an MPI to your shop.
-
Product
Conformal Coating Inspection
-
Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.
-
Product
Cargo and Vehicle Inspection
-
In a world where threats continue to evolve and concealment techniques become more sophisticated, our customers are facing more complex, difficult missions than ever.
-
Product
Optical Inspection System
OIS Products
-
A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
-
Product
Mask Foreign Matter Inspection Device
PR-PD2HR
-
Efficient foreign matter inspection and measurement with high yield.
-
Product
Post Wire and Die Bond Inspection Machine
IV-E1700
-
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
-
Product
BGA Sockets
-
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
-
Product
Inspection Microscope
Z-NIR
-
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
-
Product
X-ray Inspection System
X-eye SF160 Series
-
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
-
Product
8th Gen Intel® Core™ Processor BGA 1528
AIMB-233
-
Supports Intel® Core™ core i7-8665UE /i5-8365UE/I3-8145UE/Celereon 4305UE, 15W TDP, BGA 1528 16nm ProcessorSupports two 260-pin SO-DIMM up to 64GB DDR4 2400 MHz SDRAMSupports multiple display I/O supports versatile Tri display functions for HDMI,Support PCIex1, 2 M.2 (1 F/S miniPCIe), 4 USB 3.1, 2 USB 3.0 and 2 SATA IIISupport wide range 12V~24V DC Input and low profile heightSupports WISE-PasS/RMM and Embedded Software APIsSupport SUSI, WISE-DeviceOn and Edge AI
-
Product
3D Solder Paste Inspection (SPI)
-
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
