BGA Inspection
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Product
In-line Inspection And Integrity Services
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The safety, integrity, and operating efficiency of your assets are at the core of what we do. Baker Hughes Process & Pipeline Services (PPS) unique portfolio of services helps you confidently manage the lifecycle of your pipeline—delivering timely and stress-free startup, supporting day-to-day reliability, and enabling controlled decommissioning.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Robotic Inspection Made Easy
i-Robot
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The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
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Product
Building Inspection Kit
MR160-KIT2
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Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
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Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Automotive Inspection Kit
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Produced specifically for the automotive aftermarket and Insurance Assessors, 3rd party consultants, body shops and used car sales, these kits provide an instant measure of the coating thickness of panels.An illuminated magnifier is supplied to enable close inspection of bodywork.Measurement parameters include:Surface temperatureSurface inspectionCoating thickness
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Product
Coatings Inspection Division
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For over seventy years, Elcometer has been a world leader in the design, manufacture and supply of inspection equipment to the coatings industry. Whether you are measuring surface profile, surface cleanliness, dry film thickness, porosity, adhesion or gloss; or testing the abrasion, scratch resistance or elasticity of a coating - Elcometer's extensive and versatile range of equipment provides the complete solution to your coatings inspection requirements, whatever and wherever they might be.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Advanced Automated Optical Inspection (AOI)
V510i Optimus 3D
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V510 has high productivity, the superior detection capability and inductory fastest inspection speed. It is by High Speed Multi Frequency Phase Shift Profile technology and simultaneous inspection method of 2D/3D. V510 can inspect that without influencing the surface condition and the warp of the board by unique lighting technology.By much algorithm, inspevtion of the component smoothness and the very small component is possible.
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Product
GPR System for Concrete Inspection
StructureScan Mini XT
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Geophysical Survey Systems, Inc.
The StructureScan Mini XT is GSSI’s newest generation of our very popular all-in-one GPR systems. The StructureScan Mini XT offers a 2.7 GHz antenna for superior target resolution and can reach depths of 20 inches (50 cm). Ideal for locating rebar, conduits, post-tension cables, voids, and real time determination of concrete slab thickness.
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Product
PosiTector Inspection Kits
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PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Automatic Flight Inspection System
AT-950
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The AT-950 is the easiest to use and the fastet performing FIS available.
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Product
Thickness and Flaw Inspection
OmniScan SX
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Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Product
Portable gear inspection- and 3D-measuring systems
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ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Product
Printed Circuit Board Inspection System
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NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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Product
WiFi Inspection Cameras
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WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
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Product
X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Product
The Complete Solution for Optical Surface Quality Inspection
OptiLux SD (Scratch-Dig)
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RedLux’s OptiLux SD system provides the complete solution for control of optical surface quality (scratch-dig) by offering a breakthrough in measurement performance along with conformity to industry standards. Designed with flexibility in mind and further enhanced by a range of customer inspired features, the OptiLux SD can support the most demanding of optical surface quality inspection processes, from highly customized optical components in low volume, to standard components in high volume.
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Product
3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Product
Smart Factory Inspection System
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API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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Product
Industrial Inspection Cameras
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Industrial Inspection Cameras are our top-of-the-line inspection cameras. They feature glass lenses, superior optics, crystal-clear displays, and compatibility with the thinnest probes on the market. All Industrial Inspection Cameras were recently upgraded to capture VGA (640 x 480 pixel) resolution video clips and remove glare and reflections from them. All cameras in this sub-category are made in Taiwan, making them compliant with the Trade Agreements Act (TAA) of 1979a necessity for many buyers with the U.S. military and federal agencies.
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Product
DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
Interposer
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
Video Inspection Scope
BK3000
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• Integrated 8.5 mm high-res imager allows for ease of use and ensures the product is always ready to go. Imager is resistant to dust, dirt, and water ingress for 30 minutes at depths of up to 3 meters.
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Product
Cylinder Inner Wall Inspection
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The CylinderInspector is an optical, non-destructive inspection and measurement tool for cylinder surfaces.
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Product
X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Product
Automated Optical Inspection System
AOI Series
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Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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Product
Industrial CT X-Ray Inspection System
X5000
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The X5000 is the most versatile system offered by North Star Imaging. The system boasts a large scanning envelope and excellent ergonomics for loading sizable objects while still maintaining the sensitivity to inspect even the smallest of items.
