Showing results: 76 - 90 of 344 items found.
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Buckleys Ltd.
Battery boxes can be tested for faults by placing the box on a metal plate. By applying a test voltage to an electrode inside the box, the moulding can be checked thoroughly - particularly at the injection points - and any faults found. Defects will be identified by a spark passing from the electrode, through the defect itself, to earth (the conductive material placed outside the battery box.
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LAP GmbH
Contour Check Shape has proven itself in hot rolling of long products and is an essential part of the rolling process in many factories. It checks hot and cold steel profiles with the help of three-dimensional surface reconstruction. Thus, it records geometrical errors due to rolling defects including surface defects like scale seams, shells or roller outbreaks.
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7200 -
Chroma ATE Inc.
Among several factors for PV to achieve grid-parity, Reliability of the PV Modules plays an important role. Since its known that some of the cell defects such as edge chips/ flakes, bumps of cell surface were proved to be source of infant mortality of the c-Si PV modules, therefore, to detect those defects is very important for c-Si cell manufacturers.
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ASML
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Euresys Inc.
Unsupervised mode: train only with “good” images to detect and segment anomalies and defects in new imagesSupervised mode: learn a model of the defects for better segmentation and detection precisionWorks with any image resolutionSupports data augmentation and masksCompatible with CPU and GPU processingIncludes the free Deep Learning Studio application for dataset creation, training and evaluationOnly available as part of the Deep Learning Bundle
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Nanotronics Imaging
Nanotronics uses artificial intelligence to give our customers’ unprecedented freedom and control for defect detection. We offer an AI based Anomaly Detection Algorithm (ADA) toolkit that automates the work of writing computer vision algorithms to detect and classify defects on bare substrate and epi wafers as well as on thin films, glass and any other material with a uniform background.
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Denshijiki Industry Co., Ltd.
And the eddy current generated on the specimen by the specimen by the action of the magnetic field can not be detected (defect) and the change due to the influence of the material is detected.
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Pulse2 -
Sonix Inc.
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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YIS and SF Series -
RMS Vision Systems Inc
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.The SF300M and SF300N systems offer a low cost functionally equivalent alternative to the YIS series.
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IV-110I -
In.D Solution
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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DEFECTOMAT® Product Familiy -
Foerster Instruments, Incorporated
The DEFECTOMAT systems by FOERSTER were specially developed for quality testing and process monitoring of long products. From hot testing to all bright steel processing steps, the surfaces of semi-finished products made from austenitic, (non) ferromagnetic metals can be tested for defects. The DEFECTOMAT systems operate in a contactless and non-destructive manner in accordance with the eddy current method and are used for detecting short defects, such as holes or localized defects and transverse defects. The systems detect defective materials fully automatically and reliably. Defects can be marked, classified, and automatically discarded. the test speed of up to 150 m/s facilitates 100% testing, even at high production speeds. The systems benefit from low operating costs and frugal energy consumption as well as low maintenance costs, few wear parts, and low use of materials.
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7633A -
Peaceful Thriving Enterprise Co Ltd
Multi-Channel automotive noise finder is a portable equipment to diagnose the defect of the vehicle. When the generator is running, it can detect the impact and vibration due to the defect and failure of bearing, gear, valve, crank, cylinder, gear box, and vehicle body…etc. With this equipment, the repairer can clearly locate which part of the machine cause the noise and how serious is it; even though the repairer operates the equipment in a very noisy environment.
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603d -
Testronics Inc.
A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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TR7700 SIII 3D -
Test Research, Inc.
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
