Showing results: 181 - 195 of 344 items found.
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Angara -
ViTec Co. Ltd
The machine vision system ASKKM "Angara" is designed to detect and reject defects in the marking of labels, excise stamps, boxes, vials, ampoules, bottles, etc., which have visual manifestations in the field of permanent or variable printing. It is installed on a conveyor or mounted in a labeling machine. Labels are checked before being applied to the product or marking on the package.
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Green Hill Software, Inc.
Static analyzers attempt to find code sequences that may result in buffer overflows, resource leaks, or many other security and reliability problems. Source code analyzers are effective at locating a significant class of defects that are not detected by compilers during standard builds and often go undetected during run-time testing or typical field operation.
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Quadra 3 -
Nordson Corporation
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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7925 -
Chroma ATE Inc.
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Echo VS -
Sonix Inc.
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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FX-942UV -
YesTech, Inc.
Nordson YESTECH’s advanced multiple camera imaging technology offers high-speed inspection with exceptional defect coverage. With dual sided viewing (top-down and bottom up) cameras and UV lighting the FX-942 inspects conformal coating coverage and verifies correct part assembly in SMT or THT applications, enabling users to improve quality and enhance yields.
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VDL-01AB -
Hachmann Innovative Elektronik
VisualDetect LCD is an easily operated voltage detector and interface-tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-tester warns against defect interfaces. Additionally the LC-display indicates the measured current [I/A] and frequency [f/Hz]. Thanks to the integrated configuration menu it can be adjusted to switchgears operated below nominal voltage on-site.
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NGS 3500L -
RMS Vision Systems Inc
This top performance system is designed for applications where high-speed defect detection and precision measurements on wafers and other parts are required. It is well suited for use as a dedicated production tool or as a versatile processdevelopment system. It features a powerful set of automated as well as semi-automatic optical/ video tools optimized for high accuracy, production throughput, and ease of use.
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National Technical Systems
Destructive Physical Analysis (DPA) is the process of disassembling, testing, and inspecting electronic components to verify the internal design, materials, construction, and workmanship. This process of sample inspection is used to help ensure that electronic components are fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for identification of production lot problems.
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Teledyne LeCroy
Using our decades of knowledge and experience of Bluetooth, markets and products we'll help you deliver products which are free of defects, minimize field issues, lower development costs and reduce time to market. Teledyne LeCroy offers test services to help in all stages of product development from Specification to Market Launch and beyond.
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FX-940 ULTRA -
YesTech, Inc.
Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
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X-eye 7000B -
SEC Co., Ltd.
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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X-eye 7000BS -
SEC Co., Ltd.
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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INSPECTRA® Series -
Toray Engineering Co., Ltd.
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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QES Mechatronic Sdn Bhd
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
