Showing results: 46 - 60 of 344 items found.
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“DC Fault Tester” -
NPC Incorporated
Identifies defect position instantly- contributes to saving inspection time
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Probing Solutions, Inc.
Fast, sensitive, economic, off-line photomask defect review. Our 300 series photomask inspection and review stations use long working-distance microscopy and a unique four-way lighting system to greatly speed up location and identification of micron- and submicron-sized defects
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X-eye 6200 -
SEC Co., Ltd.
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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3Si Series -
Saki Corporation
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Wafer Series -
Park Systems Corp.
Park's Smart ADR provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.
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X-eye 6300 -
SEC Co., Ltd.
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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UltraScan -
Syntest Technologies
UltraScan is SynTest's solution to combat increase in test time. In 130 nm or smaller ? nanometer geometries, many defects become delay defects and it becomes necessary to use delay tests to detect the transition faults and path delay faults. Often bridging tests are also required.
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7213-AD -
Chroma ATE Inc.
Defects causes by back-side printing process of C-Si PV cells will also cause performance, reliability impact. Among all the back-side printing defects, bumps caused by improper printing may cause high cell breakage rate during lamination of c-Si module process.
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Buckleys Ltd.
A high voltage holiday detector is a quick and effective means of locating defects and faults in pipeline coatings (either enamel or tar wrap). As manufacturers of high-voltage test equipment; we have created 'Pipeline Test Kits' which provide all the necessary equipment to test for such defects.
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X-eye SF160 Series -
SEC Co., Ltd.
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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YIS 200 -
RMS Vision Systems Inc
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.
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LIGHTiX -
Unity Semiconductor SAS
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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SONOSCAN I -
SONOTEC GmbH
The SONOSCAN immersion transducers for Non-destructive Testing (NDT) are mainly used to test metals and plastics for the smallest material defects. For example, binding defects, welding defects or cracks and pores in metal parts can be detected. The powerful, robust ultrasonic probes can be connected to all common ultrasonic testing devices. Due to variable designs and sizes, the immersion probes guarantee optimal use. In addition to ultrasonic standard pobes, we also offer customized transducers according to your individual specifications.
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HDM Series -
Park Systems Corp.
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
