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other than specified, imperfection .


Showing results: 256 - 270 of 344 items found.

  • PXI Fault Insertion / Signal Insertion Switch Modules

    Pickering Interfaces Ltd.

    Pickering's PXI Fault Insertion / Signal Insertion Switch Modules feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect all of which can simulate connectivity problems in the system. Two switching topologies are available: *Single signal paths with series switches and switches to connect to one or more fault buses*Pairs of signals with series switches, shorting switches between the signal pairs and switches to connect either signal to an external fault input.

  • MPI Sorter Series

    MPI Photonics Automation

    MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.

  • Circuit Breaker Time Interval Meter

    Crest Test Systems Pvt. Ltd.

    Measuring contact timings is useful for finding the contact bounces and non-simultaneity of contacts. This helps in finding the possible electrical or mechanical defects in the circuit breaker contacts. Timing analysis also make it possible to detect incorrect mechanical adjustments and wear phenomena of the circuit breaker by measuring the differences between the fastest and slowest phases.

  • PD Surveyor with RFI & EMI Diagnostics

    PDS200 - Doble Engineering

    The Doble PDS200 is a combination survey tool that uses radio frequency interference and electromagnetic interference diagnostics to find signs of partial discharge.This hand-held instrument is an ideal tool for a condition based maintenance program, allowing you to quickly find insulation defects in motors, generators, transformers, cable terminations and additional substation components.

  • kSA Emissometer

    k-Space Associates, Inc.

    The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers.  Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.

  • Panaya Release Dynamix

    Release Dynamix - Panaya, Ltd.

    Panaya Release Dynamix (RDx) enables organizations to drive innovations by enabling the continuous delivery of business-driven changes with speed and simplicity. Traceability – Users can map tests and defects to business change request and development requirements, increasing quality and business assurance. Agility – Change delivery managers can enable continuous delivery through visibility into requirements, user stories and tasks. Compliance - Organizations can employ a requirement approval workflow to comply with internal as well as regulated change introduction processes while continually managing the change lifecycle process.

  • Automated Optical Inspection (AOI)

    TR7700 SIII - Test Research, Inc.

    TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.

  • Wafer Level Test

    Chroma ATE Inc.

    Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.

  • Automated Semiconductor Wafer Optical Inspection and Metrology

    SITEview Software - Microtronic, Inc.

    Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.

  • Diode & Rectifier Test Systems

    D&V Electronics LTD

    D&V’s diode and rectifier test systems provide a quick, accurate and easy to use interface to check and measure all main parameters of regular and avalanche rectifiers. Real life conditions are simulated to maximize diagnostic capabilities. Additionally, analysis of the rectifier’s thermal resistance can be performed to detect poor internal diode connections and related defects.

  • Test Services For Circuit Board

    Acculogic, Inc.

    Acculogic Contract Testing Services group with multiple locations in United States, Canada, Germany and China provides Cost Effective, On-Demand (Quick-Turn) testing service. Our circuit board assembly test services include defect analysis, In-Circuit, Boundary Scan JTAG and Functional testing on industries most widely used test platforms.

  • Battery Element Testers

    1652/1653 - STS Instruments

    All STS Battery Element Testers provide a unique method for the detection of assembly level insulation defects in lead-acid batteries, including missing and damaged separators. Detection of such faults prior to filling and charging the battery minimizes costly reclamation. Traditional AC dielectric tests can detect such faults, but may produce damaging heat in moist cell applications.

  • Thermal Imager with App

    testo 872 - testo AG

    The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.

  • Substrate Manufacturing

    KLA-Tencor Corp

    KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.

  • Bench PIM Tester - iBA series

    iBA - Kaelus

    Passive Intermodulation (PIM) occurs when multiple RF signals encounter defects in materials or workmanship in an RF path. These defects behave like a mixer causing noise to be generated at mathematical combinations of the original carrier frequencies. PIM interference that falls in the receive band of a wireless system elevates the noise floor resulting in high dropped call rates, call blocking, slow data transmission speeds and decreased system capacity.Kaelus is the industry leader in Passive Intermodulation test solutions. Since 1996 Kaelus has supplied RF equipment manufacturers around the world with precision IEC compliant test equipment to perform this critical test. From initial product design through high-volume manufacturing, Kaelus offers a wide range of PIM test solutions that enable equipment manufacturers to quickly and confidently verify the performance of their products.

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