Showing product results. 1 - 15 of 159 products found.
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National Technical Systems
As a manufacturer of computer hardware and/or software, its import to know how well you stack up to your competitors. That’s going to be the first question that your customer are going to want to know about your product – Is it easier to use? Is it faster? Is it better? Do you know? NTS can develop a detailed competitive analysis test plan to help you find out.
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ASTM D257 - National Technical Systems
These test methods cover direct-current procedures for the measurement of dc insulation resistance,volume resistance, and surface resistance. From such measurements and the geometric dimensions of specimen and electrodes, both volume and surface resistivity of electrical insulating materials can be calculated, as well as the corresponding conductances and conductivities. These test methods are not suitable for use in measuring the electrical resistance/conductance of moderately conductive materials. Use Test Method D4496 to evaluate such materials. This standard describes several general alternative methodologies for measuring resistance (or conductance). Specific materials can be tested most appropriately by using standard ASTM test methods applicable to the specific material that define both voltage stress limits and finite electrification times as well as specimen configuration and electrode geometry. These individual specific test methodologies would be better able to define the precision and bias for the determination.
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ASTM D149 - National Technical Systems
This test method covers procedures for the determination of dielectric strength of solid insulating materials at commercial power frequencies, under specified conditions. Unless otherwise specified, the tests shall be made at 60 Hz. However, this test method is suitable for use at any frequency from 25 to 800 Hz. At frequencies above 800 Hz, dielectric heating is a potential problem. This test method is intended to be used in conjunction with any ASTM standard or other document that refers to this test method. References to this document need to specify the particular options to be used. It is suitable for use at various temperatures, and in any suitable gaseous or liquid surrounding medium. This test method is not intended for measuring the dielectric strength of materials that are fluid under the conditions of test. This test method is not intended for use in determining intrinsic dielectric strength, direct-voltage dielectric strength, or thermal failure under electrical stress (see Test Method ASTM D3151). This test method is most commonly used to determine the dielectric breakdown voltage through the thickness of a test specimen (puncture). It is also suitable for use to determine dielectric breakdown voltage along the interface between a solid specimen and a gaseous or liquid surrounding medium (flashover). This test method is similar to IEC Publication 243-1. All procedures in this method are included in IEC 243-1. Differences between this method and IEC 243-1 are largely editorial. Note: The above information is taken directly from the test method Scope published in ASTM D149.
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National Technical Systems
Differential scanning calorimetry (DSC) measures Specific Heat Capacity, Heat of Transition, and the Temperature of Phase Changes and Melting Points. DSC measures the rate of heat flow, and compares differences between the heat flow rate of the test sample and known reference materials. As a sample undergoes a transition (melting, crystallization, etc.), heat is absorbed or emitted. This change in heat flow is then measured by the system and can be analyzed. The difference determines variations in material composition, crystallinity and oxidation.
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National Technical Systems
NTS electronics failure analysis capabilities can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices as well as materials and assemblies.Electronics F/A can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a F/A should be performed to identify the root cause of failure. The information presented in the root cause F/A will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased F/A performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.
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National Technical Systems
Airworthiness authorities require that aircraft be protected and certified against the effects of lightning, but few such regulations exist for sensitive facilities on the ground. If it is possible to protect an aircraft that is highly dependent on electronics from a direct lightning strike, it is certainly possible to protect important ground-based facilities. For this purpose, professionals must re-evaluate and update lightning protection methods for advanced facilities. NTS and Lightning Technologies have been in the forefront of this technology for more than 20 years.
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ASTM G21 - National Technical Systems
Many products that operate in warm, humid environments must be tested to withstand fungal attacks, since this problem can cause myriad of operational challenges. To varying degrees, live fungi will use wood, paper, leather, hydrocarbons, PVC, polyurethanes, certain plastics and paints, along with other materials, as fuel for growth.
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(HAI) UL 746A - National Technical Systems
High-Current Arc Ignition (HAI) performance is expressed as the number of arc rupture exposures (standardized to the electrode type and shape and electric circuit) that are necessary to ignite a material when they are applied at a standard rate on the surface of the material. The number of arc rupture exposures necessary to ignite a material when they are applied at a standard rate on the surface of the material. Performance Level Categories (PLC) were introduced to avoid excessive implied precision and bias.
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UL 746A - National Technical Systems
The High Voltage Tracking Resistance (HVTR) test method is used to assess the susceptibility to tracking of insulating materials that are exposed to high voltages outdoors. Insulators installed in the open are often at the mercy of humidity. Their electrical insulation properties can deteriorate to such an extent as a result that tracking paths are formed on the insulator surface. This test determines the tracking resistance that defines the dielectric strength of the insulating material surface and the maximum allowable leakage current (tracking).
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National Technical Systems
To sell your product in different international markets, you need to follow rules and regulations that vary significantly from country to country. The process for achieving country–specific certification can be complex, bureaucratic, time-consuming, and expensive. To ensure you enter a new market, therefore, you need to make sure you’re up-to-date on the latest regulations and approval requirements. The good news is that the experts at NTS can help you get your product into more than 180 countries without delay. Take a moment to explore the interactive animation below to get additional insights regarding international approvals and country-specific product certification.
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National Technical Systems
Microsectional Analysis remains the most widely accepted means for analyzing the PCB/PWB plated through-hole integrity. A PCB is a combination of different types of materials such as glass, aramid fibers, kapton, copper, acrylic adhesive, epoxy, polyimide, Teflon, and solder. Each of these materials has a different relative hardness and, coupled with that of the mounting media such as epoxy or acrylic, makes the PCB microsection one of the most difficult to perform.
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IPC/JEDEC J-STD-020D.1 - National Technical Systems
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ”cracks and delamination” from the solder reflow process. This document describes the standardized Moisture Sensitivity Levels (MSL) of floor life exposure for moisture/reflow-sensitive SMD packages along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. Companion documents J-STD-020D.1 and JEP113 define the classification procedure and the labeling requirements, respectively.
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ASTM D1781 - National Technical Systems
This test method is used to compare adhesion between flexible and rigid adherents, or between flexible facing of a sandwich structure and its core. Comparisons of adhesives and processes are only applicable when test specimens and conditions are the same. The peel resistance may indicate degree of cure for relatively brittle adhesives.
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National Technical Systems
With more than a half-century of experience in the precision cleaning industry, NTS has become the preferred precision cleaning supplier. Many of our nation’s premier aerospace and defense contractors, National Security and Homeland Defense Programs rely on NTS.
