Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Probe Card Solutions
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Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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Standard GaN Amplifiers
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A GaN (Gallium Nitride) amplifier is a power amplifier that uses GaN, a wide-bandgap semiconductor material, to provide high power density, efficiency, and frequency capabilities.
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Enterprise Yield Management Solution
dataConductor
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dataConductor is an interactive enterprise yield management solution for the semiconductor industry. With dataConductor, semiconductor manufacturers can collect data from diverse, global manufacturing systems and combine them into a single warehouse to manage yields during data characterization, yield ramp and volume production.The dataConductor platform is a comprehensive enterprise yield management system built upon our high-performance dC Warehouse. dataConductor features an optimized Oracle database, standard and custom data parsers, and a full suite of analysis capabilities that can be tailored to your particular environment.
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Dimensional Metrology
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Nova offers in-line optical integrated and stand-alone metrology platforms. The metrology product portfolio, combined with our modeling algorithm software, delivers unique measurement capabilities for the most advanced semiconductor technology nodes.
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Custom Coatings
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MICROMATTER provides custom coating services (single or multi-layer) on customer supplied glass, metal and semiconductor substrates.
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Materials Metrology
VeraFlex Family
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World-class XPS and XRF metrology technologies for semiconductor process control.
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Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Software Options
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Sonix offers powerful microscopy analysis software to enhance packaged semiconductor imaging, accelerate production and adapt systems based on the ECHO platform to customer-specific requirements.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
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High Power Pulse Instruments GmbH
The high-current TLP/HMM test system TLP-12010A offers advanced features intended for the characterization of semiconductor devices, discrete components, such as TVS, varistors, capacitors, gas tubes, circuits and systems in the high power time domain. It includes high current I-V characteristics inpulsed operation mode, turn-on/off transient characteristics of the device, breakdown effects, charge recovery effects e.g. reverse recovery, Safe-Operating-Area (SOA) and ESD measurements in general.
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Variable Angle Spectroscopic Ellipsometer
VASE
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The VASE is our most accurate and versatile ellipsometer for research on all types of materials: semiconductors, dielectrics, polymers, metals, multi-layers, and more. It combines high accuracy and precision with a wide spectral range up to 193 to 2500nm.
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X-Ray Inspection System
MXI Quadra 5
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Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Laser Interferometers
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ZYGO laser interferometers support and enable the most demanding metrology applications in industries from semiconductor and lithography to space-borne imaging systems, cutting-edge consumer electronics, defense-related IR and thermal imaging systems and ophthalmics.
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UV Meters
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OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
Motion Controller
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Test Contactor/Probe Head
Hydra
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Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
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MEMS Spring Probe
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MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
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Solid-State And Electromechanical Relay Products
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Relay is the name for a switch that is operated electro-mechanically or electronically. Their main task is to make and break connections to control the flow of current in electrical circuits. They’re used for various purposes ranging from validating semiconductors to interfacing low power computers or microcontrollers with high power machinery.
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Thin Film Composition and Thickness Monitor
P-1000
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The Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications.
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0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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RF Bias Burn-In System
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These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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Low Leakage Switch Mainframe
B2201A
Mainframe
The B2201A reduces the cost of test by enabling characterization tests to be automated, with only slight compromise to the measurement performance of the semiconductor parameter analyzer. It supports a 4-SMU, full-Kelvin configuration and a capacitance meter, with room for future expansion. Includes 14 inputs, each with a unique internal measurement path, and a distinctive capacitance measurement compensation feature for two of the inputs. Provides front panel control via keypad or optional light pen, and supports instruments such as pulse generators.
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Materials Metrology
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Nova is a market leader for innovative thin film metrology and process control technologies. We develop highly sensitive in-line metrology solutions on high productivity platforms, thereby enabling critical metrology solutions to be closer to a semiconductor fab’s process and integration needs.Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
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Package Inspection Products
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Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Thermal Conductivity Analyzer
Model 2000B
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Teledyne Analytical Instruments
The Series 2000 represents a complete line of Thermal Conductivity Detector (TCD) based analyzers which can be applied in a wide range of applications and industries. By using field proven filament-based and semiconductor based TC detectors, Teledyne is able to continuously monitor hydrogen and a variety of other gases of interest in either binary or multi-component sample gas streams.
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Semiconductor Curve Tracer
CS-5000 Series
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*Max. Peak Voltage : 5,000V（HV mode）*Max. Peak Current : 1,500A（HC mode）*Equipped all models with LEAKAGE mode (Cursor resolution 1pA）*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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Metrology Systems
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VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
