Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Micromanipulator
XYZ 300 Series
Quarter Research and Development
The XYZ 300 Micropositioners provides 3-axis motion with .300" movement on each axis. Motion is controlled by three adjustment screw knobs that provide .025" resolution per turn. A general purpose micro positioner, it is intended for industrial, medical, biological, semiconductor, and general scientific applications.
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Electrostatic Voltmeters
Wolfgang Warmbier GmbH & Co. KG
The electrostatic voltmeter ESVM 1000 is a microprocessor based non-contacting voltmeter which measures the electrostaticcharges on very small objects. It is an ideal instrument for measurements on semiconductors, printed circuitboards, connector pins and other areas where a conventional electrostatic fieldmeter cannot be used.The ESVM 1000 comes with a high resolution sensor which provides accurate results even in very small areas.
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3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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Thermalyze Extension for Steady State Analysis
Lock-In
Steady-state thermography is limited to detecting hot spots that heat up a minimum of 100 mK (0.100°C). This may be useful for locating shorts on high-power devices, but is inadequate for detecting low power defects such as semiconductor device leakage current or short circuit with very low or very high resistance. Steady-state thermography also suffers from poor spatial resolution as the heat from localized hot spots diffuses rapidly, blurring the location of the heat source.
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Thermal Control Products
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
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Surface Analysis
Shimadzu offers a range of instruments that are ideal for all sample forms handled by customers in the fields of steel, non-ferrous metals, environment, foods, chemicals, pharmaceuticals, semiconductors, ceramics, and polymers. EPMA/SEM offers analysis of targets from several centimeters to several microns; XPS offers analysis from several millimeters to several microns; and SPM permits observations from over a hundred microns to several nanometers.
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Benchtop Discrete Component Tester
Imapact 7BT
The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability.
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Software Options
Sonix offers powerful microscopy analysis software to enhance packaged semiconductor imaging, accelerate production and adapt systems based on the ECHO platform to customer-specific requirements.
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13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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UV Meters
OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Wide Bandgap Transistors
The key for the next essential step towards a more energy-efficient world lies in the use of new materials, such as wide bandgap semiconductors (WBG) which allow for increased power efficiency, smaller size, lighter weight, lower system cost or all of these together. STMicroelectronics offers the broadest product and technology portfolio of silicon carbide (MOSFETs) and gallium-nitride-based (e-mode HEMT) devices, covering bare dies, discretes and modules belonging to the STPOWER family.
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Wide Temperature Range HDR USB3.1 Gen1 Camera Board (Color)
See3CAM_CU20
See3CAM_CU20 is a 2.0 MP HDR USB camera board with ultra-Lowlight performance. It has an ability to stream seamlessly at wide temperature range (-40°C to 85°C). This Full HD USB3.1 Gen1(5Gb/Sec.) camera is based on 1/2.7" AR0230AT CMOS digital image sensor with a pixel size of 3.0 μm x 3.0 μm from ON Semiconductor™. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It is a Plug-and-Play camera (UVC compliant) for Windows, Linux. This HDR camera is also backward compatible with USB 2.0 host ports.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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ICP-OES Analyzer
SPECTRO ARCOS
SPECTRO Analytical Instruments GmbH
The SPECTRO ARCOS ICP-OES excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.Its unique new MultiView plasma interface option provides truly uncompromising axial-view and radial-view plasma observation in a single instrument. The periscope-free MultiView mechanism lets an operator literally "turn" a radial-view instrument into an axial-view device, or vice-versa, in 90 seconds or less. Visit the MultiView Q&A section in the ARCOS Resource Center for answers to frequently asked questions. Plasma power enters a whole new era with the system's innovative generator. This unique, compact and extremely rugged component is based on laterally diffused metal oxide semiconductor (LDMOS) technology. It delivers the highest plasma power available today, enabling previously impossible feats of analysis at the highest plasma loads.
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Materials Metrology
VeraFlex Family
World-class XPS and XRF metrology technologies for semiconductor process control.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
High Power Pulse Instruments GmbH
The high-current TLP/HMM test system TLP-12010A offers advanced features intended for the characterization of semiconductor devices, discrete components, such as TVS, varistors, capacitors, gas tubes, circuits and systems in the high power time domain. It includes high current I-V characteristics inpulsed operation mode, turn-on/off transient characteristics of the device, breakdown effects, charge recovery effects e.g. reverse recovery, Safe-Operating-Area (SOA) and ESD measurements in general.
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Laser Head
5517FL
The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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FT-IR and FT-NIR Analyzers
ABB capabilities encompass one of the largest portfolios in the world for laboratory, at-line and process FT-IR/FT-NIR analyzers. Founded in 1973, ABB Analytical Measurements (formerly Bomem Inc) designs, manufactures and markets high-performance, affordable FT-IR / FT-NIR spectrometers as well as turnkey analytical solutions for Petroleum, Chemical, Life Sciences, Semiconductor, Academic, Metallurgy, OEM industries and spectroradiometers for Remote Sensing/Aerospace market.
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Semiconductor Device Testers
are particularly suitable for certain semiconductor test requirements, but other models may also be of interest. Our knowledgeable application engineers can guide you to the most suitable model.
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5.0 MP Camera For Rockchip RK3399
E-CAM50_CU96
e-CAM50_CU96 is a 5MP Fixed focus MIPI camera for 96Boards compliant Rock960 developer kit featuring Rockchip RK3399 processor. This 4-lane MIPI Camera for Rock960 board is based on our popular low-light camera module, e-CAM55_CUMI0521_MOD which has 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® and a built-in Image Signal Processor (ISP). It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement.
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FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Semiconductor Curve Tracer
CS-3000 Series
*Max. Peak Voltage : 3,000V（HV mode）*Max. Peak Current : 1,000A（HC mode）*Equipped all models with LEAKAGE mode (Cursor resolution 1pA）*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
