3D
three dimensions.
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BIM Consulting Services
Being Revit BIM outsourcing company, our consultants facilitate 3D Modeling (Architectural, Structural, and MEP), 4D BIM Construction Scheduling, 5D Cost Estimation, Clash Coordination, Scan/PDF/CAD to BIM Conversion, Shop drawing, Construction Documentation . Tejjy Integrated project delivery with Autodesk Revit software for Architecture, Structure, MEP workflow allows smooth execution through a quality assured BIM Management lifecycle.
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MPO/MTP Multi-Fiber Interferometer
Anfkom International Co.,Limited
It is an automatic and non contact fiber endface interferometer for both multi fiber and single fiber connectors. It can measure the geometry parameters of multi fiber connector such as fiber height,core dip, X and Y angel, radius of curvature with white light and measure geometry parameters of single fiber connector with red light. The software can display the surface of the connector in 3D image for a very short time, it need only 8s to test 12-core MT connector. It is intelligent , efficient,stable and accurate and very helpful in improving the quality of the product.
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3D Scanning Reverse Engineering Services
Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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Software
ThreeParticle
Imagine 3D simulation would be easy to learn in a few days, entry barriers would be minimal, and applications almost limitless. This is already a reality with our revolutionary ThreeParticle ™ software . In a single simulation platform, the Discrete Element Method (DEM) can be used to simulate multi-physical systems with complex particle shapes, including multi-body dynamics (MBS), structural mechanics (FEM) and liquids (CFD) - without coupling to external packages. The simple and intuitive operation via a new user interface is the daily routine of simulation.
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Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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3D Scanner Software
3DX Engine
*Easy step-by-step user interface, low learning curve, suitable even for first time users*Recovery mode always protects all your scan project and data from computer crash and power outage.*Texture Scanning (OBJ format)
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832x600 Pixel High Resolution Time-of-Flight (ToF) CMOS Image Sensor
Hydra3D+
Hydra3D+ is a 832 x 600 pixel resolution Time-of-Flight (ToF) CMOS image sensor, designed with Teledyne e2v’s proprietary CMOS technology, and is tailored for versatile 3D detection and measurement.
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Seismograph
Geode DZ
The Geode DZ 3D seismic system from Geometrics is the result of over 30 years of experience in building seismographs that have been used all over the world for an amazingly broad range of survey types. The knowledge we have gained over the years has allowed us to provide you with the Geode DZ - a reliable, low entry cost, easy to use 3D seismic system.
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Software
3D Pro™
Textron Systems' 3D Pro software is an add-on module for RemoteView™ that allows analysts to incorporate imagery in near real-time to create rich, 3D scenes.
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High-Speed Digital Image Correlation System
Q-450
The 3D High-Speed Image Correlation System Q-450 allows the full-field, non-contact and three-dimensional dynamic measurement of shape, displacements and strains on components and structures made from almost any material. Based on the digital image correlation technique, the Q-450 system is designed for full-field vibration analysis and high speed transient events. This makes it ideal for ballistics testing, fracture mechanics, shock excitations, the Hopkinson Bar test, or Impact Testing.
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X-ray Microscopy
ZEISS Xradia Versa
Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM feature dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.
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Benchtop X-ray Crystallography System
XtaLAB mini II
The Rigaku XtaLAB mini II, benchtop X-ray crystallography system, is a compact single crystal X-ray diffractometer designed to produce publication-quality 3D structures. The perfect addition to any synthetic chemistry laboratory, the XtaLAB mini II will enhance research productivity by offering affordable structure analysis capability without the necessity of relying on a departmental facility. With the XtaLAB mini II, you no longer have to wait in line to determine your structures. Instead your research group can rapidly analyze new compounds as they are synthesized in the lab.
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QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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3D Laser Imager
Vector-DD
The Vector 3D laser imager offers multi wavelength, full waveform data capture, coupled with the flexibility of an all-sky scanner. The Vector-DD is a direct detection (DD) 3D (range, angle, angle) active imager with an all-sky full hemisphere scanner. It employs a nodal point design so that all the lines-of-sight converge to a single point at the instrument*. In addition, two wavelengths can be transmitted so that differential reflectivity information can be derived. The unit is compact and portable and operates from 24V DC.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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SparkFun GPS-RTK Dead Reckoning Breakout
ZED-F9R (Qwiic)
The SparkFun ZED-F9R GPS Breakout is a high precision, sensor fusion GPS board with equally impressive configuration options and takes advantage of u-blox's Automotive Dead Reckoning (ADR) technology. The ZED-F9R module provides a highly accurate and continuous position by fusing a 3D IMU sensor, wheel ticks, a vehicle dynamics model, correction data, and GNSS measurements.
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Smart 3D Scanner For Education And Hobby At An Affordable Price
NEO
Allows you to easily scan objects for further 3D printing
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RF Shielded Enclosure for Pre-Compliance EMC and CTIA Testing
QuietBox-AR "Mini-Range"
The Raymond RF QuietBox-AR is a mobile solution for pre-compliance EMC and CTIA testing, 3D antenna pattern measurement, and total radiated power & total isotropic sensitivity testing. Fully equipped with client-specified broadband absorber, integrated antenna and rolling cart, the QuietBox-AR is a cost effective option for product verification prior to fully compliant testing.
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Articulating Measuring Arms
Aberlink 3D measurement software can be retrofitted to a huge range of portable measuring arms, including Faro, Romer, Cimcore and others.
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X6 Optical Fiber Fusion Splicer
Smart-connected APP, Splicing record management, Intelligent burglary-resisting system 1 sec. topspeed boot time, 6 sec. splicing time, 12 secs. Heating time. 3D protection cover reduce risk and unpredictability. Handy, lightweight, anti-dropping solid and durable.Hi-Speed USB connection internet remote control.
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PCI Express Graphic Card with NVIDIA® Quadro® P4000
Quadro-E PEG P4000
The Quadro-E PEG P4000 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1792 CUDA cores, 8GB GDDR5 onboard memory and support for up to four 8K (7680×4320 @ 60 Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
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Industrial Computed Tomography
TomoScope® L
High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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High Performance UV Nanoimprint Resist
AMONIL®
UV Nanoimprint is a mechanical molding technique. A template made from quartz or a flexible elastomer with a 3D relief is brought into intimate contact with a UV-curable resist spin-coated on top of a substrate. Applying low imprint pressure at room temperature features are filled within seconds due to the low viscosity of the imprint resist. The resist is hardened via UV-light through the backside of the template. Finally substrate and template are separated. The replicated resist relief can further be transferred into the substrate via RIE-process or used as functional element.
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Volcanic Ash Detector
Accurate measurements of atmospheric content for Volcanic Ash MonitoringVertical or 3D
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Optical Measurement Methods and Characterization Services
The Fraunhofer IOF develops optical measurement methods and systems to customer requirements. Key areas include the characterization of optical and non-optical surfaces, coatings, components and systems in the micro and sub-nano range as well as 3D shape acquisition.
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Turnkey PCI-PTS Mobile POS (MPOS) Terminal
MPOS-STD2-PRO
The MPOS-STD2 reference design is a PCI-PTS MPOS-in-a-box terminal that comes with a complete set of hardware, software, and documentation including schematics, PCB layout, 2D and 3D design files, reports from security labs.
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Laser Scanning Systems
QFP markets manually handled and optically tracked 3D laser scanners that set new standards in the metrology measurement industry. The products are characterized by exceptional performance, ease of use and cost-effectiveness and are the perfect solution for the metrology room as well as for the production line, stand-alone or automated.
