3D
three dimensions.
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Automotive Infotainment SoCs
ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Portable Measuring Arms
A-LINE
Trimos A-line portable articulated measuring arms allow an extremely easy and accurate 3D measurement.
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Reverse Engineering Services
Whether for global manufacturers or small custom shops, API’s measurement expertise, combined with advanced metrology equipment, can execute convenient and fast reverse engineering projects. Our Laser scanning services can create data from an existing part or compare captured data to a CAD model. Reverse engineering services include scan as-built parts to creation of a 3D digital point cloud and CAD Model.
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Handheld 3D Scanner
Peel
Accurate handheld 3D scanner for fast and easy data collection. A next-generation companion to Verisurf software for digitizing/reverse engineering & high volume pointcloud inspection.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Advanced Design System (ADS) Core
W2200BP
Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
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3D AOI
Zenith2
Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Virtual Interface Technology for 3D-IC Metrology
VIT
TSV profile (depth, top & bottom CD, tilt, SWA)-Residue Detection-RST-Copper Nail Height-Bump Height and Cu pillar height-Edge trim profile
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Enhanced Vision Systems
Elbit Systems of America’s Degraded Visual Environment (DVE) solution uses intuitive 3D grid symbology along with a helmet tracker to provide critical helicopter/tilt-rotor cues during brownout operations. This system, which is an upgrade to the head-up display installed on many military helicopters, removes weight or drag penalties by eliminating nose-mounted sensors. The helmet tracker provides numerous ancillary benefits such as depicting the other pilot’s Line of Sight (LOS) for improved crew coordination, as well as providing the ability to slew weapons or optical payloads to the pilot’s LOS, hands-free and heads-up.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Coordinate Measuring Machines
CMM
Aberlink offers a wide range of bridge and hexapod CMMs to suit all applications and budgets, enabling the precise measurement of the smallest of components to parts of over 3 metres long and up to 6 tonnes in weight with a wide range of touch-trigger probes and non-contact measurement options. The comprehensive range of CMMs includes 32 standard sizes of both CNC and manual variants. All CMMs are supplied as a complete turnkey package including the Aberlink 3D measurement software, the easiest to use and most intuitive CMM software currently available.
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Software
LIDAR Analyst™
Textron Systems' LIDAR Analyst software is tightly integrated with the Esri® ArcGIS® platform to provide an end-to-end solution for visualizing and processing LIDAR data. Analysts can automatically extract 3D objects such as bare earth, trees or buildings, enabling users to visualize their world for critical decision making.
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Video Signal Generator
MSHG-600 Plus
MSHG-600Plus supports a exclusive HDMI 1.4a Signal and output signal to five(5) channels. It is also built-in CEC function according to current market request. *3D video Format Support *It can be On/Off Audio Return Channel with ARC switch separately.
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Coordinate Measuring Machines
VideoCheck® UA
Ultra Accurate multisensor coordinate measuring machine in fixed bridge designHighest accuracy due to use of low vibration precision air bearings and solid granite constructionThe VideoCheck® UA features scale resolution in the nanometer range and a special design that reduces measurement errorsCan be equipped with high-precision sensors including the high precision 3D Fiber Probe.Use of high precision telecentric lenses in a second optical beam pathModular structure guarantees customized solutions for individual applicationsIntegrated vibration isolation dampeners
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3U CompactPCI Serial Intel® Xeon® W Processor Blade
cPCI-A3535 Series
- Intel® Xeon® W-11555MRE 6-Core processor- Max. 64GB DDR4-3200 by 2x SODIMMs- 80GB 3D Nand flash SSD in SLC mode- USB 3.2, USB-C and RJ-45 iAMT front panel service ports- 2x M12 2.5GbE front panel ports for on train use
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3D Scanning Reverse Engineering Services
Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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RZ/G1 32-bit MPUs
The RZ/G1 high-performance 32-bit processors have 1GHz+ Arm® Cortex®-A cores, a 3D graphics engine, a full high-definition (HD) video engine, secure IP, high-speed interfaces such as PCIe, SATA and Gigabit Ethernet, and other functions necessary for embedded devices in the industrial segment.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Semiconductors
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Robot Guidance Systems
Robot guidance using 3D vision systems designed for object localization is making a vital contribution to the optimization of industrial manufacturing processes. Robot guidance systems from SICK give users an easy, economical way to benefit from this sophisticated technology. The systems stand out thanks to their reliable, user-friendly design. They can be integrated without difficulty in existing environments, deliver high-precision measurement results and consequently play a key role in making part handling more versatile than ever before.
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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3D Building Scanning Services For Existing Conditions
Trusted by industries across USA, Tejjy 3D laser scanning company facilitates high-resolution reality capture of as-built data. Our on-site 3D scanning professionals gather accurate measurement with quality point clouds of as-built condition. We facilitate precision of 4-6 mm approx. in field measurement for renovation, surveying, facility management, digital twin, heritage preservation as per client requirements.
