Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Operation Support System for Wafer Prober
N-PAF
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Wafer Level Multi-Die Test System
ITC55WLMD
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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WDXRF Wafer Analyzer
2830 ZT
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Combined Map Display Unit & Interface Unit Tester (COMED)
MS 1117
This system is used to test COMED (Combined Map Electronic Display) IFU cards. This ATE checks the LRU Status and card status and identify faulty component in the individual UUT. On fault, this suggests the possible component failure as diagnostic report, for repairing the cards.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Bare Wafer Inspection System
LS-6700
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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One click site mapping
PowerMapper
PowerMapper is an automatic site mapping tool for information architects, usability analysts and web developers. It is used in more than 50 countries, by 30% of the Fortune 100, and major organizations like NASA and MIT.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Film Thickness Mapping Systems
Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Locate and Map Underground Utilities
UtilityScan DF
Geophysical Survey Systems, Inc.
UtilityScan DF incorporates our innovative dual-frequency digital antenna (300 and 800 MHz) and an easy-to-use touchscreen interface to view shallow and deep targets simultaneously in a single scan.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Pressure Mapping
TIRESCAN
Complete pressure imaging system for conducting tire tread analysis.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Industry Standard in GPR for Utility Mapping and Locating
GSSI’s Utility Scan Pro GPR
Geophysical Survey Systems, Inc.
With UtilityScan Pro, users can quickly identify and mark the position and depth of metallic and non-metallic objects; including utilities such as gas, communications and sewer lines as well as underground storage tanks and PVC pipes. Based on the SIR 4000 controller, the UtilityScan Pro provides the GPR professional with solutions to any underground locating situation.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
