Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
-
Product
Ambient Temperature Vacuum Wafer Chucks
-
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
-
Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
-
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
-
Product
Wafer Probe Test System
STI3000
-
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
-
Product
Wafer Demounting And Cleaning Machines
-
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
-
Product
Digital Map Systems
-
Elbit Systems of America’s Global Digital Map Unit is built on a proven design that accommodates multiple data formats and provides unmatched situational awareness to aircrews. The GDMU displays detailed map, flight plan, and threat information to aircrews. Each system performs interactive functions with the mission computers and generates digital video map data for head down displays.
-
Product
Full Wafer Contact Test System
Fox 1
-
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
-
-
Product
Bare Wafer Inspection System
LS-6700
-
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
-
Product
Wafer Chucks
-
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
-
Product
Pressure Mapping Technology
-
Measure interface pressure between two surfaces, utilizing a thin and flexible sensor. The resulting data and our analysis tools offer insights to enhance product design, manufacturing, quality, and research.
-
Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
-
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
-
Product
Semi-Automatic Contactless Wafer Detector
NCS-200SA
-
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
-
Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
-
Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
-
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
Product
MPI PA Wafer Probers
-
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
Stand Alone Wafer Sorter
MicroSORT
-
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
-
Product
2D/3D Wafer Metrology System
7980
-
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
-
Product
Wafer Prober
Precio octo
-
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
-
Product
Wafer Prober
Prexa MS
-
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
-
Product
Wafer Level Test
-
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
-
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
-
Product
Wafer Prober
Prexa
-
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Wafer Thickness Measuring System
WT-425
-
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
-
Product
Wafer Test
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
-
Product
Pressure Mapping Sensors
-
The pressure sensors listed below are available in a wide range of shapes, sizes, pressure ranges, and resolutions. Over 200 different pressure sensors are available. High Temperature pressure mapping sensors are also available in certain sensor models. Custom tactile pressure sensors and pressure ranges can also be created to meet your specific application requirements. Please note, the sensors listed in this catalog are matrix sensors designed to be used with one of Tekscan's pressure mapping systems. If you need single-point force sensors for testing, or custom force sensors for embedded/OEM applications, please refer to our FlexiForce™ products. For more application and industry details, see some of our key sensor application and industry solutions.
-
Product
Wafer Level Multi-Die Test System
ITC55WLMD
-
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
-
Product
Operation Support System for Wafer Prober
N-PAF
-
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
