3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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Bottom-up and Top-down 3D Modular AOI
SpectorBOX
With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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(AOI) Automated Optical Inspection Systems
For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Can Inspection
Whether they are 14oz cans, 28oz cans, 12oz bottles, or some other size or format – they typically all look fine, as they fly by on your production line or sit on pallets ready to go out to customers. The challenge is, most companies have some kind of sealing issue at some point. Tops go on crooked, lids don’t seal, vacuums don’t set right – and it’s nearly impossible to tell by physical or visual inspection.
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Inspection Class ROV
Phantom® L Series
THE PHANTOM® L6 IS THE NEWEST IN THE NEXT GENERATION OF PROVEN, RELIABLE UNDERWATER ROBOTICS PIONEERED BY DEEP OCEAN ENGINEERING IN ITS MANUFACTURE OF REMOTELY OPERATED VEHICLES (ROV), BUILT IN THE USA FOR NEARLY FOUR DECADES.
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Soldering Test
The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Optical 3D Measuring Systems & Devices For Your Quality Assurance
As a manufacturer of optical industrial metrology, we offer a broad portfolio of optical 3D measuring systems & devices to support companies in various industries with precise quality assurance in production. Based on Focus Variation technology, our measuring systems not only enable surface roughness measurement, but also the detection of micro-geometries, shapes and structures.
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Ensenso 3D Cameras
X Series
Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Solid Optical 3D Measurement Instrument
IF-SensorR25
The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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Optical Inspection System
OIS Products
A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
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Abrasive & Blast Inspection
Blasting parameters: A number of important parameters need to be monitored during the blasting or water jetting process, these include: air pressure (at the nozzle), nozzle diameter, blast media contamination & pH values in order to avoid recontamination of the substrate during blasting.
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3D Scanning Software
Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Manual Spin Rotary Table for Optimal Circular Geometry (TIR) Inspection
TruMotion
Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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Fiber Inspection and Cleaning
Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
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SparkFun Solder-able Breadboard
Mini
This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Silicon Inspection System
NIR-01
The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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Foreign Matter Inspection Device For FPDs
HS-930
By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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Waterproof Inspection Cameras
waterproof inspection cameras have waterproof probes, General's DCS6XX wet/dry cameras, the DCS600A, DCS605, DCS660A, DCS665 & the DCS665-ART, go one step further because their grips and monitors are also waterproof. This feature, unique in the industry, allows users to inspect toilets and water and sewer lines carrying running water without worrying about dropping and "dunking" the instrument.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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3D Measurement
PSD-Array
The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Double Sheet / Splice Inspection
Leuze electronic GmbH + Co. KG
Double-sheet control sensors enable the reliable differentiation between one or more layers of very thin objects made of different materials. This allows, for example, single-layer paper sheets to be reliably pulled in or individual electrodes to be stacked for the production of a battery cell. Different operating principles, based on ultrasonics and capacitive sensors, cover the range of materials for different applications. Sensors for splice inspection detect desired and random splices in paper webs independent of the surface color and material properties.
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Automated And Manual Sample Inspection
In addition to typical in-process, continuous dynamic measurement applications, LaserLinc’s non-contact measurement equipment is well suited for manual and automated off-line sample inspection. Inspecting cylindrical products with long, thin characteristics, such as camshafts and catheters requires checking multiple locations and dimensions for accuracy. Manual inspections of these areas can be difficult because of the complex profile as well as the need for numerous measurement stations, different equipment and skilled personnel.
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NUV-PL SiC Defect Inspection System
VS6845E
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Inspection and Maintenance
Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
