3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
3D AOI Series
MV-9
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
3D Optical Profiler
7503
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Chroma 7503 uses the technology of white light interfaces to measure and analyze the surface profile of micro-nano structures with sophisticated scanning system and innovative algorithms.
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Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Product
9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
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9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
Inspection Bundle
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Cost effective bundle of eVision's inspection librariesIncludes EasyImage, EasyGauge, EasyMatch, EasyObject and EasyColor
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Product
01 With Soldering Eyelets | 10 Positions | M6
01-1xxx-00/30xxx-10-M
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Multi wafer compact selector with 36° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Ultra High Performance 3D CT System
UltraTom
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3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Product
Solderability Tester
MUST 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Product
3D AOI Series
MV-6 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
37-Pin D-Type Male Solder Pin HV
92-960-037-MHV
D-Sub Male Connector
This accessory is designed to allow users to directly terminate a cable with soldered connections. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical safety precautions are observed.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
Optical Inspection
3D AOI
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In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Product
01 With Soldering Eyelets | 12 Positions | M8
01-1xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Automated Optical Inspection System
AOI Series
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Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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Product
Single Mode Multimode Test Inspect Kit
KI-TK072A
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1310/1550/1625 nm & 850/1300 nm source & Autotest power meter + acceptance reporting software, inspection microscope, cleaning materials. Interchangeable SC/APC & LC/APC connectors
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Product
High-Accuracy Automated Optical Inspection Systems
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Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Conformal Coating Inspection System
TROI 8800 CI
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The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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Product
Lab Inspection & Testing Services
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Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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Product
3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
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This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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Product
Inspection System for Die Casting
X-eye 7000BS
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Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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Product
Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
Automated X-ray Inspection (AXI)
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Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Product
Visual Inspection Software
AdVISE
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R&S®AdVISE visual inspection software automates the process of visually monitoring an equipment under test (EUT) during a test sequence. This eliminates human inattention, ensures reproducible results and simplifies the test documentation. A typical application is EMS testing with R&S®EMC32 and R&S®ELEKTRA test software.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Inspect & Explore Indoor and Confined Spaces
ELIOS
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Discover the first collision-tolerant drone, designed for the inspection and exploration of the most inaccessible places. Allowing for the first time to fly in complex, cluttered or indoor spaces, Elios unleashes the potential of UAVs in numerous applications where their use was previously too dangerous or simply impossible.
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Product
Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Product
3D Measurement And Inspection
LOTOS
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LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
