3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
Replacement Solder tip lead set for D420/D620
Dx20-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Product
Sound Level Meter for Automotive – Car Noise Emission Inspection
HD2010MCTC
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The level of noise produced by vehicles shall comply with standards prescribed by international regulations. During car inspections, horns and exhaust devices must be in good condition and comply with the requirements.
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Product
3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
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This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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Product
Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
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Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
End Face Inspection Microscopes
D SCOPE EFI – D SCOPE EFI-C – D SCOPE EFI-C LWD
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The new D Scope EFI for MTP/MPO and multifibers field connectors is a cost effective microscope for inspecting fiber optic patchcords and cassettes.
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Product
3D And 2D Visualization Software
3DViz
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The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
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*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
3D Sound Intensity Analysis Software
DS-0225A
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Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
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Product
3D Helmet Coil
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With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Bottom-up and Top-down 3D Modular AOI
SpectorBOX
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With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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Product
Industrial CT X-Ray Inspection System
X3000
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The X3000 is North Star Imaging’s newest standard system. Whether you are inspecting small or large components, the X3000 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
3D Electromagnetic Simulation Software
XFdtd®
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A full-featured simulation solver, XFdtd outpaces other methods in efficiency as the number of unknowns increases. XF includes full-wave, static, bio-thermal, optimization, and circuit solvers to tackle a wide variety of applications, including antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more. It also works with Remcom's ray-tracing products to provide thorough simulation capability at the low-, middle-, and high-end of the electromagnetic spectrum.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
Baggage and Parcel Inspection
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Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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Product
Connector, 104-Pin D-Type Male, Solder Bucket, 5A
92-960-104-M
D-Sub Male Connector
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied without backshell. This connector is not compatible with Pickering modules that use the 104-pin D-type connector.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
68-Pin SCSI Micro-D Female Solder Bucket
40-962-068-SB-F
SCSI Female Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Smart 3D Scanner For Education And Hobby At An Affordable Price
NEO
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Allows you to easily scan objects for further 3D printing
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Product
Handheld 3D Laser Scanner
Freestyle3D Scanner
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The FARO Freestyle3D is a top-quality, high-precision, handheld scanner for professionals. It quickly and reliably documents rooms, structures and objects in 3D and creates high-definition point clouds. With unbeatable precision, it is suitable for all uses in which installations, properties or environments must be quickly measured from various perspectives. The applications of the FARO Freestyle3D include construction, industrial engineering, and forensics.
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Product
FieldMaster 3D
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Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Product
Industrial CT X-Ray Inspection System
X25
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The X25 is quite possibly the most conveniently sized industrial CT system on the market. The system offers all of the same features as the larger systems while still maintaining the ability to fit through a standard interior door. The X25 is well suited for small to medium sized objects.
