3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
End Face Inspection
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Cleave quality inspection. High precision interferometers for checking the end face quality of cleaved optical fibers and for cleave process optimization. Crisp and clear fringe patterns and software with advanced measurement functionality. Ideal for use in production settings and when working with difficult to cleave fibers in laboratory environments. Fiber holder adaptors available for use with cleavers and splicers from the major splicer manufacturers. This facilitates easy transfer of the fiber from cleaver to interferometer and then onto the splicer with no need for reclamping.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
High-Accuracy Automated Optical Inspection Systems
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Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Product
Metra Scan 3D
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The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
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Product
Fiber Optic Inspection & Cleaning
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One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex, 3D structures created in the fab.SEMulator3D process modeling and analysis is used for fast and accurate “virtual fabrication” of advanced nano-fabrication processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles.
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Product
3D Design
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Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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Product
3D Measuring Laser Microscope
LEXT OLS5000
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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Product
68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
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This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
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Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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Product
9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
D-Sub Male Connector
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
Connector, 104-Pin D-Type Female, Solder Bucket, 5A, 4-40 UNC Screwlocks
C104DFR-2SB-1A
D-Sub Female Connector
This 104-pin female D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell. This connector is suitable for use with Pickering modules that use the 104-pin D-type connector.
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Product
68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
SCSI Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
ATR 3D Layout Machine
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ATR Model is standrad layout machine for marking work and 3D measruing.
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Product
3D Sensing
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The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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Product
Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Product
3D Scanner
Lion3DX
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Lion3DX is desktop size 3D scanner with high accessibility for everyday use, equipped with automatic 2-axis platform.
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Product
Power Transmission Line Inspection System
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Shandong Senter Electronic Co., Ltd
With the aid of high-end technology and equipment, Senter Electronic manufactures and trades high-tech power transmission line inspection system with low price. And we are known as one of the leading such manufacturers and suppliers in China for our quality products and good service. Welcome to buy the power transmission line inspection system with our factory.
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Product
Wireless Fiber Inspection Probe
OCI-20BN-W
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OCI-20BN-W is a portable optical fiber connector inspector for checking fiber and connector end-face cleanliness, ideal for bench top and fiber optic network installation technicians to eliminate error caused by poor quality or improper cleaning.OCI-20BN-W offers excellent viewing on connector/fiber end-face and is able to feature to record and save image/video of fiber end-face; It can be connected to PC or phone by WIFI.More than 40 assorted high-precision tips designed for inspection solutionsAngled/Lengthened tips for awkward positions.Connect smart phone for testing FiberEye2 is the application on an android or IOS smart phone to capture, display and record the fiber end-face image from the Wi-Fi probe.Connect tablet/laptop for testing EFD is the analysis software on Windows tablet/laptop to have dusts, and scratches on end face inspected, analyzed, compiled and reported
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Product
Ultra High Performance 3D CT System
UltraTom
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3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Product
Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Product
Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
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VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Product
GPR System for Concrete Inspection
StructureScan™ Mini
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Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
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Product
Digital Automated Interferometer for Surface Inspection
DAISI
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DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
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Product
9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
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9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
Non-contact 3D Optical Profilers
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LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
