3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
-
Product
20-Pin GMCT Male Connector, 16A, Panel Mount, Solder Bucket
40-963-020-16A-M
GMCT Male Connector
The 40-963-020-16A-M connector is designed to allow users to directly terminate a cable with soldered connections. It is supplied with removable solder bucket contacts suitable for wires up to 14 AWG. Included is the screwlocks/fixing screws and male solder bucket contacts.
-
Product
Inspection Microscope
-
This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
-
Product
3D Antennas
-
A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
-
Product
X5 Pipeline X-Ray Inspection
-
Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
-
Product
3D Sound Intensity Analysis Software
DS-0225A
-
Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
-
Product
Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
-
Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
-
Product
Sensor for Filament Inspection
EyeFI
-
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
-
Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
-
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
-
Product
High-speed 3D Solder Inspection Machine
YSi-SP
-
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
-
Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
-
*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
-
Product
X-ray Inspection System
X-eye SF160 Series
-
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
-
Product
3D Design
-
Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
-
Product
MT Inspection Scope
Um
-
● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
-
Product
High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
-
Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
-
Product
X-ray Inspection System
NEO-690Z / NEO-890Z
-
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
-
Product
Chip Inspection System
GEN3000T
-
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
-
Product
Protective Inspection Kit for Hazardous Areas
-
The kit provides all the tools required for the on-site inspection of a coating, including surface profile, dewpoint, relative humidity, both wet and dry film thickness and also adhesive testing.Measurement parameters include:Surface inspectionSurface profileSurface contaminationClimatic conditionsCoating thicknessAdhesion
-
Product
Semiconductor Inspection (SEMI)
-
A process for detecting any particles or defects in a wafer.
-
Product
Vision Inspection Products
-
Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
-
Product
Wafer & Die Inspection
-
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
-
Product
3D Scanning Coordinate Measurement Machine
CUBE-R™
-
CUBE-R™ is a fast, reliable, and efficient complete turnkey solution for automated quality control applications. This automated 3D measuring machine features MetraSCAN 3D-R, a powerful robot-mounted optical 3D scanner that can be integrated into factory automation systems without compromising on accuracy. It is the perfect alternative to solve any productivity issues caused by bottlenecks at the traditional coordinate measuring machine (CMM).
-
Product
Intelligent PCB Inspection
-
It uses a proprietary image analysis system based on Artificial Intelligence. Eliminates time-consuming (re)programming of the process thanks to advanced self-learning. Guarantees high efficiency of the error detection process regardless of the type of component or PCB being inspected. Effectively supports decision-making processes in the area of quality control. Fully compatible with every production line. Ideal for high-variability production models thanks to self-configuration.
-
-
Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
-
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
-
Product
Defect Inspection and Review
-
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
-
Product
Terahertz Imager for Material Inspection
T-SENSE FMI
-
This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
-
Product
Digital Automated Interferometer for Surface Inspection
DAISI
-
DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
-
Product
Real-time X-ray Inspection Systems
Ultra-Compact™
-
Glenbrook Technologies redefines X-ray Inspection with our smallest JewelBox Micro focus x-ray system yet. With dimensions of just 22”W x 26”L, it’s small enough to fit on a standard desk, in an office or small lab. But it’s big in capabilities with >500x magnification , 5 axis manipulator and advanced image processing. To view our product video, please click below the product image to the right.
-
Product
Digital Inspection Probes
DI-1000
-
The ergonomically designed DI-1000 is Lightel’s all digital video microscope probe. It connects directly to your PC through the computer’s USB2.0 port. Featuring easy single finger focusing, a built-in image freeze/capture button, and detectable resolution to 0.5µm, the DI-1000 package includes our free ConnectorViewTM (standard) software, providing digital zoom, image display, image capture, auto-calibration and basic analysis tools.
