3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
Make Your 3D Control Smarter
VALUE ADDED SOLUTIONS
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At Metrologic Group, we always seek to be a problem-solver for industrial manufacturers and quality assurance professionals. That is why, we continuously develop improvements of our software and complementary solutions to respond or even outreach customer expectations.
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3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Economy 3D Scanners
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Cost-effective 3D scanners with high-end technology, provide you with 3D scanning capabilities to fit within your budge
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3D Machine Vision Systems
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Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
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3D Laser Imager
Vector-DD
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The Vector 3D laser imager offers multi wavelength, full waveform data capture, coupled with the flexibility of an all-sky scanner. The Vector-DD is a direct detection (DD) 3D (range, angle, angle) active imager with an all-sky full hemisphere scanner. It employs a nodal point design so that all the lines-of-sight converge to a single point at the instrument*. In addition, two wavelengths can be transmitted so that differential reflectivity information can be derived. The unit is compact and portable and operates from 24V DC.
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PWB Visual Inspection Machine (AOI/SPI)
RV-2
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PWB size: 50mm×50mm - 410mm×360mm 630mm×360mm(longer sized PWB)*. Item of inspection: Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Test & Inspection
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Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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Real-time X-ray Medical Device Inspection System
The Bench-X
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Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
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Optical 3D Measuring Systems & Devices For Your Quality Assurance
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As a manufacturer of optical industrial metrology, we offer a broad portfolio of optical 3D measuring systems & devices to support companies in various industries with precise quality assurance in production. Based on Focus Variation technology, our measuring systems not only enable surface roughness measurement, but also the detection of micro-geometries, shapes and structures.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Solderability Tester
MUST 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Product
Pulsed DC Holiday Detector Inspection Kit
280
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The Elcometer 280 Pulsed DC Holiday Detector is a ‘stick type’ holiday detector that has been designed to make pulsed DC high voltage holiday detection safer, easier and more reliable than ever before.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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Product
160-Pin DIN41612 Connector, Solder Pin, Male
40-960-160-M
DIN41612 Male Connector
Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
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Product
3D Measuring Laser Microscope
LEXT OLS5000
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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Product
3D Scanning Coordinate Measurement Machine
CUBE-R™
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CUBE-R™ is a fast, reliable, and efficient complete turnkey solution for automated quality control applications. This automated 3D measuring machine features MetraSCAN 3D-R, a powerful robot-mounted optical 3D scanner that can be integrated into factory automation systems without compromising on accuracy. It is the perfect alternative to solve any productivity issues caused by bottlenecks at the traditional coordinate measuring machine (CMM).
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Verification And Print Quality Inspection Solutions
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Integrate quality barcode verifiers within your production line using our robust barcode verification technology.
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Ground Resistance Inspection Box
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AllWin Instrument Science and Technology Co., Ltd.
Check the ground resistance tester each time prior to start work everyday morning and do some relevant records.
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Magnetic Particle Inspection
NDT
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DCM Tech offers a comprehensive selection of Magnetic Particle Inspection machines for non-destructive testing (NDT). Easily and quickly detect internal and subsurface damage on critical parts. Contact DCM to speak to your regional Technical Specialist about adding an MPI to your shop.
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Wide Range Film Inspection
790
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For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
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GPR System for Concrete Inspection
StructureScan™ Mini
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Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
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Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
37-Pin D-Type Male Solder Pin HV
92-960-037-MHV
D-Sub Male Connector
This accessory is designed to allow users to directly terminate a cable with soldered connections. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical safety precautions are observed.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
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*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
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Simple 3D Measurement & Inspection
XG-X Series Vision System
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Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Automated 3D Scanner
HDI Compact
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The HDI Compact 3D scanning system eliminates the tedious work involved with manually scanning an object. Save time and get stunning results everytime. The HDI Compact is an automated 3D scanning solution. The rotary table automatically spins the object and stops at predetermined intervals. The scan head captures high resolution, accurate 3D scans of an object each time. Once the object spins a full 360 degrees, all the scans are then automatically cleaned up and merged together to create a full digital 3D model.
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Surface Defect Inspection System
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Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible





























