Showing results: 196 - 210 of 384 items found.
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SEN-30001-T -
Playing With Fusion Inc
Breakout board for the MAX31855T digital thermocouple interface IC. Measured temperature range is -270C-400C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header, has a vertical mini thermocouple connector and four mounting holes for standoffs and 4-40 screws.
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SEN-30001-J -
Playing With Fusion Inc
Breakout board for the MAX31855J digital thermocouple interface IC. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header, has a vertical mini thermocouple connector and four mounting holes for standoffs and 4-40 screws.
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ShibaSoku Co., Ltd.
Multi-pin type model is now launched in WL27 Logic/Power mixed LSI test system.This system is suitable for multi-site test in A/D mixed device such as automotive・motor driver IC. It’s a high throughput and cost performance mixed signal LSI test system.
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3380P -
Chroma ATE Inc.
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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3380D -
Chroma ATE Inc.
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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National Technical Systems
The ever advancing electronics industry requires an increasing need for electronic component testing (IC testing) and component verification. The component test capabilities and component verification lab at NTS performs test and inspection to determine proper component functionality, verification or failure analysis (F/A).
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8636 -
Technobox, Inc.
The Technobox, Inc 6083 4-lane and 8638 1-lane carrier card allows use of a PMC in a PCI Express edge card slot. The product features an IDT TSI384 bridge IC used in transparent mode with a PCI Express primary side and a PCI/PCI-X secondary side.
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Winslow Adaptics, Ltd.
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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6083 -
Technobox, Inc.
The Technobox, Inc 6083 4-lane and 8638 1-lane carrier card allows use of a PMC in a PCI Express edge card slot. The product features an IDT TSI384 bridge IC used in transparent mode with a PCI express primary side and a PCI/PCI-X secondary side.
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7116 -
Peaceful Thriving Enterprise Co Ltd
This is a low power consumption, high accuracy and stable hand held 2000 counts multi-meter; with special designed IC to support true RMS measurement. It performs measurements of DC voltage/current, true RMS AC voltage/current, resistance, diode, continuity, temperature and non-contact voltage sensing.
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LogicTouch -
SV Probe, Inc.
The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL''s LogicTouchTM is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).
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784961-01 -
NI
1.91 GHz Intel Atom Quad-Core Processor, 2-USB3 Port Industrial Controller - The IC‑3121 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3121 offers two USB3 ports with dedicated bandwidth, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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Renesas Electronics Corp.
Renesas' light-to-voltage silicon optical sensors combine a photodiode array, a non-linear current amplifier and a micropower op amp on a single monolithic IC. Applications for these devices include display backlight control, keypad dimming, anti-glare mirror systems, and industrial and medical light sensing applications.
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3916A -
Pomona Electronics
Dip Clip, 16 pin with Nickel Silver contacts. Pomona DIP Clip® test clips are designed for testing dual-in-line IC packages on PC boards. These devices incorporate many built-in features that assure a positive electrical connection as well as hands free testing.
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MICRONICS JAPAN CO.LTD.
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.