Showing results: 121 - 135 of 384 items found.
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QE49 -
Qmax Test Technologies Pvt. Ltd.
The QE-49 IEEE1149.1 Boundary Scan Trainer Kit was developed by Qmax to provide user a good understanding and hands on the testing principals of boundary scan namely the scan chain test, interconnect test, non-BS functional testing of logic IC and cluster like a combinational or sequential circuits.
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SimPrep -
Teledyne LABS
- Wide range of syringes from 10 μL to 50 mL- A single system can serve multiple techniques such as ICP-MS, ICP, AA, Colorimeter, IC, FIA- An extra autosampler - easily switch between sample prep and sample analysis with a switching USB hub (see below).
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Maya Heat Transfer Technologies Ltd.
Improve the design of electrical and wire harnesses, electronic systems, and integrated circuits (IC). Find software solutions to facilitate the development of electrical systems for large, complex platforms.
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Xeltek
SuperBOT is an automatic IC programmer with high performance and reasonable price for large-scale electronic product manufacturing. This programmer can automatically pick up, place, program, take out and pack up chips. SuperBOT 3 is capable of supporting most MCU, CPLD, serial and parallel NOR/NAND FLASH.
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8023 -
VECTOR Electronics and Technology, Inc.
3-hole solder pad for interconnecting multiple component leads. I/O area with square solder pads for connectors mounting. Circuit pattern etched onto both sides. Double sided with plated thru holes. Solder mount DIP sockets or IC devices with any lead spacing.
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8001 -
VECTOR Electronics and Technology, Inc.
3-hole solder pad for interconnecting multiple component leads. I/O area with square solder pads for connectors mounting.Circuit pattern etched onto one side only. Single sided with no etch and plating on reverse side.Solder mount DIP sockets or IC devices with any lead spacing.
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Ironwood Electronics
No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Omega Engineering, Inc
Used for immersion temperature measurement in liquids, air, gas, or wells in solid material, Omega offers a large variety of probe styles in thermocouple, RTD, thermistor, and IC technologies.
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8003 -
VECTOR Electronics and Technology, Inc.
Pad per hole & peripheral ground plane.0.085” Square pads etched around each hole on wiring side.Accommodates any type DIP IC device or discrete component.Single sided board with pads and peripheral GND plane on one side only.Single-sided with no etch and plating on reverse side.
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1111163 -
Aries
40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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Renesas Electronics Corp.
High-speed CMOS output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a CMOS output IC on the output side. This coupler is a high common mode transient immunity (CMR), high-speed CMOS output type device designed for high-speed logic interface circuits.
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784970-01 -
NI
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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784965-01 -
NI
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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785270-01 -
NI
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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784227-01 -
NI
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.