Showing results: 61 - 75 of 384 items found.
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SystematIC
An IC development is never a reproduction of a previous IC, however there is no need to invent the wheel twice.Considering our extensive IC design experience in the domain of power control we will likely find existing IP blocks to speed up a new IC development. We gladly evaluate if and how our IP can be succesfully reused or applied in your next IC development, and focus on achieving your essential IC requirements in a shorter development time.Our experience includes the following elements which have been developed in a diversity of technologies, from standard CMOS process (mostly 180nm) to 350nm 700V CMOS.
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Advanpack Solutions Pte Ltd.
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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MAX3232 -
SparkFun Electronics
The 'must have' IC for TTL/CMOS projects finally has its own breakout board! This is the RS232 converter IC that is capable of running at 3V and communicating with 5V logic.
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STAr Technologies, Inc.
STAr has developed a proprietary patented vertical probe card design that is tunable for wide varieties of parametric, mixed signal, memory IC and logic IC applications.
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1111903 -
Aries
24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC?s. A cost effective means of upgrading to SOIC without changing your PCB layout.
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MS-177 -
Misum Systech Co., Ltd.
This equipment is used for PCM function test to check thestate ofsingle IC PCM as well as dual IC PCM. It is applied for only 1Cell PCM and can consist ofup to 40 Channels.
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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DSOX1EMBD -
Keysight Technologies
The IC, SPI, and UART/RS-232 serial decode option for InfiniiVision 1000 X-Series oscilloscopes (DSO models) displays responsive, time-aligned, on-screen decode of Inter-Integrated Circuit (IC), 3-wire Serial Peripheral Interface (SPI), and UART/RS232 serial communication buses. Because it is hardware-based, this option provides the fastest throughput solution for triggering on and analyzing IC, SPI and UART/RS-232 serial buses found in a wide variety of embedded designs.
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STMicroelectronics
ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
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XX-666000-00 -
Aries
SOIC to SOWIC Adapter. Allows the use of a narrow package IC in place of a wide one.
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KLA-Tencor Corp
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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CY7C65213 -
SparkFun Electronics
The CY7C65213 USB to UART serial breakout is designed to provide users with a means to access all available I/O pins on the IC, and to provide a 6-pin UART header that is compatible with other SparkFun breakout boards. This breakout has a microUSB connector and other support circuitry to get the IC quickly up and running.
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SparkFun Electronics
This is a board designed for opto-isolation. This board is helpful for connecting digital systems (like a 5V microcontroller) to a high-voltage or noisy system. This board electrically isolates a controller from the high-power system by use of an opto-isolator IC. This IC has two LEDs and two photodiodes built-in. This allows the low-voltage side to control a high voltage side.
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SparkFun Electronics
The SparkFun 9DoF Sensor Stick is an easy-to-use 9 Degrees of Freedom IMU. The Sensor Stick deftly utilizes the LSM9DS1 motion-sensing system-in-a-chip, the same IC used in the SparkFun 9DoF IMU Breakout. It houses a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer – nine degrees of freedom (9DoF) in a single IC!