Showing results: 181 - 195 of 384 items found.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Renesas Electronics Corp.
Renesas has invested in key technologies to address the latest trends within the automotive market. Offering both standard and AEC-Q100 qualified products for automotive applications, Renesas' automotive display IC product line is defined by feature rich, highly integrated semiconductor solutions that incorporate many key function blocks for front console, rear seat entertainment, and rear camera display applications.
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FMC DEL -
Sundance Multiprocessor Technology Ltd.
An FPGA Mezzanine Card (FMC) created to produce pulses delayed by a user-programmed value with respect to the input trigger pulse. It has 4 output channels and one input trigger. The delay from the trigger input to each of the outputs can be set independently in a range from 600 ns to 120 seconds. It is implemented using a dedicated time-to-digital converter IC from the European company Acam.
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PFL780/760 -
Polar Instruments Inc
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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Crystal Vision -
FA Instruments
Crystal Vision Microscopy suites are transforming the world of IC Diagnostics and failure analysis. Intuitive software allows user friendliness and enables the breadth of analytical disciplines available. Realtime imaging from both Topside and Backside, allows for maximum productivity.
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784959-01 -
NI
The IC‑3120 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3120 offers two Gigabit Ethernet ports with Power over Ethernet (PoE) technology, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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Renesas Electronics Corp.
These are the standard reference voltage source widely used by the feedback circuits of switching power supplies. Compared to the Zener diode, which is a discrete product, a shunt regulator has much better voltage precision because voltage control is carried out as an IC.
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MicroContact AG
Frequently, manual test adapters are required for the functional and IC test. In order to contact the test subject, spring contact probes are often installed in the adapter, but the pitch of the spring contact probes is approx. 1.27 mm and thus too great for certain applications.
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Logic Family -
Advantest Corp.
To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Renesas Electronics Corp.
The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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SparkFun Electronics
This is the newest revision of this board and this breakout board pairs an SP3485 RS-485 transceiver with an FT232RL USB UART IC to convert a USB stream to RS-485. The SP3485 is a half-duplex transceiver, so it can only communicate one way at a time, but it can reach transmission speeds of up to 10Mbps.
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Qmax Test Technologies Pvt. Ltd.
Boundary Scan Trainer Kit was developed by Qmax to provide user a good understanding and hands on the testing principals of boundary scan namely the scan chain test, interconnect test, non-BS functional testing of logic IC and cluster like a combinational or sequential circuits.
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SEN-30001-KDP -
Playing With Fusion Inc
Breakout board for the MAX31855K digital thermocouple interface IC. Measured temperature range is -270C-1372C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header and four mounting holes for standoffs and 4-40 screws. It does not contain a mini thermocouple connector.
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SEN-30001-JDP -
Playing With Fusion Inc
Breakout board for the MAX31855J digital thermocouple interface IC. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header and four mounting holes for standoffs and 4-40 screws. It does not contain a mini thermocouple connector.
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SEN-30001-K -
Playing With Fusion Inc
Breakout board for the MAX31855K digital thermocouple interface IC. Measured temperature range is -270C-1372C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header, has a vertical mini thermocouple connector and four mounting holes for standoffs and 4-40 screws.