Automated High-Resolution AOI Tool Modular Inspections

Automated High-Resolution AOI Tool Modular Inspections

Next generation macro inspection system (AOI).
• All-side wafer inspection: Front, back and edge inspection.
• 100% defect images without throughput impact.
• Integrated high-end microscope review.
• True Color Inspection (TCI) technology.
• Advanced CD, 2D/3D, OVL and EBR metrology.
• Automatic defect classification
• Best in class cost of ownership for high resolution AOI
• High-speed patterned wafer inspection
• High defect sensitivity
• ISO Class 1 certified
• Tool – to – tool matching

Get Help