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Configurable Data-Logging System
NI CompactDAQ
This NI CompactDAQ configurable data-logging system includes an NI CompactDAQ controller or chassis, C Series I/O modules, and Chameleon software. It is designed for structural test and monitoring applications with the NI CompactDAQ controller, which includes built-in processing and nonvolatile storage for running Chameleon software and logging data locally. Alternatively, you can choose a USB or Ethernet chassis for a lower cost system that requires an external PC. This system accepts a variety of C Series I/O modules, so you can mix and match microphones, accelerometers, and temperature and bridge-based sensors.
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RSE Wireless EMC Spurious Emission
TS8996
The R&S®TS8996 RSE test system is designed for EMI and radiated spurious emission testing on wireless devices in semi-anechoic or fully anechoic chambers. The modular design makes it easy to extend the system to include new communications technologies. Typical devices under test include mobile phones or radio sets along with radiated measurements of other short-range devices. Standards require a wide range of test setups and a wide and high frequency range (up to 40 GHz). ESW or FSW frequency ranges are extended up to 325 GHz with option B21 using receive units TC-RSE for 5G FR2. Dedicated RSE test routines are also covered for this frequency range.
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In-Circuit Test System Repairs
Forwessun provides expert repair services for a wide range of Test Systems, helping you maintain optimal performance and extend the life of your equipment. Our team of skilled technicians quickly identifies and addresses issues, ensuring that your system is back in operation with minimal downtime. We handle both routine and complex repairs, offering comprehensive solutions to keep your systems running efficiently and reliably.
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Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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HTOL Test Systems
Our IOL & Power-Cycling systems increase measurement quality & throughput while simultaneously reducing the Total Cost of Test (TCoT) of an open platform. We focus on complete monitoring and precise temperature control for each device under test.
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Functional Test System Optimized For Real-Time Digital Bus Test
Spectrum HS
Spectrum HS is Teradyne’s fully integrated functional test system. Optimized for real-time test of low latency buses, it’s a high-performance system delivering excellent test coverage of current and future products.
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Tool, Inspection Depth Gauge, Micro Coax, Receiver
910121179
Tool, Inspection Depth Gauge, Micro Coax, Receiver
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Mini LED Backlight Module Automatic Optical Test System
7661-K003
Chroma 7661-K003 Mini LED Backlight Module Automatic Optical Test System contains a 71803-2 2D color analyzer to measure chromaticity and brightness
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HV Test System up to 20000 Volt
Insulated test booth with large space for test items. 2 banana sockets for AC connection and 4 banana sockets for the DC connection of the DUTs. IC’s are tested in a long-term test. These are checked in an oil bath so that there are no air gaps to reduce the insulation. Maximum voltage 20 kV. Therefore, insulation tests must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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Radisys Management System
The Radisys Management System is a carrier-grade management solution built to scale as your network evolves while maintaining high-performance levels.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Checkpoint Security System
ConneCT
The ConneCTTM Checkpoint Security System is an advanced aviation security explosive detection system (EDS) engineered to deliver superior threat detection, dramatically improved passenger throughput, and low total cost of ownership.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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CPE Design Verification System
Jupiter 310
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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19” Rackmount Data Collection System
DCS-211
- Intel Atom® x5-E3930 processor- Up to 8x DI and 6x DO with two 2A relays- 3x M12 GbE, 1x RJ-45 GbE, 2x isolated RS232/422/485, 2x USB and one lockable HDMI port- Up to 3x PCI Express mini slots with one USIM card slot each- Storage: up to 64GB eMMC 5.0, 1x 2.5” SATA drive bay
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In-Circuit Test System Rentals
Forwessun offers flexible test system rental options to meet short-term or seasonal testing demands. Our rental systems are rigorously tested for reliability and performance, giving you access to high-quality equipment without the need for a full purchase commitment. Customised rental agreements allow you to return the equipment when it’s no longer required, providing an ideal solution for scaling up production or filling in during periods of high demand.
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The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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X-ray Inspection System
JewelBox-90T/100T/110T™
All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Alpha Particle Counting System
UltraLo-1800
The UltraLo-1800 is a best-in-class alpha particle counting system. Our patented design reduces background rates by 50x compared to conventional systems.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Wafer Thickness Measuring System
WT-425
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Bluetooth RF Test System
FRVS
FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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Automatic Flight Inspection System
AT-950
The AT-950 is the easiest to use and the fastet performing FIS available.
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Component Test Systems
These products include test peripherals used with test systems, such as interfaces that connect semiconductor devices with test systems, and handlers that transport semiconductors to the test system. System-level test equipment and software are also included in this category.
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Scienlab Battery Test System - Cell Level
SL1007A
The SL1007A Scienlab Battery Test System – Cell Level enables you to accurately and productively test battery cells for automotive and industrial applications. The bidirectional power supply charges and discharges your cells under test with very high efficiency.
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Inspection Systems
Video Inspection Systems with?or without measurement capabilities are an excellent way to evaluate and test small items or items in?difficult to access locations. Many options are available in addition to the measurement capability. Video Inspection is used for a variety of purposes including the ability to see? and measure items that are much smaller than the eye can see or that hand tools can measure. Video systems can also reduce the eye and/or back strain associated with production environments where an operator must look in a microscope all day.
