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Other Test Systems
Your business challenges do not fit the typical mold. Your test requirements are different. Ball Systems has more than 50 years of experience in multiple industries that has exposed our team to a wide variety of testing applications. As a result, we’ve likely created a solution for a challenge similar to yours.
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Mini LED Backlight Module Automatic Optical Test System
7661-K003
Chroma 7661-K003 Mini LED Backlight Module Automatic Optical Test System contains a 71803-2 2D color analyzer to measure chromaticity and brightness
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Scienlab Battery Test System – Pack Level, 110 KW Extendable Version
SL1720A
Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development.
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CPE Design Verification System
Jupiter 310
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Parallel Electrode SMD Test Fixture, DC To 3 GHz
16196B
The 16196B surface mount devices (SMD) test fixture offers excellent repeatability and usability, with accurate correlation up to 3 GHz. 16196 series fixtures are custom designed to fit specific SMD sizes (see table below), and provide repeatable DUT positioning with reliable contacts to enable stable measurement results, reducing the possibility of operator-induced error. Traditionally, SMD inductor evaluation up to 3 GHz has been difficult to implement. Now with the 16196 series, it’s easy to perform accurate and repeatable measurements.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Fixture Kit In-Line 6TL35 455x600mm
AH500
Fixture Kit for Platforms featuring receiver Virginia Panel 9025 and external pusher system. Its heavy duty design supports more than 3000N.nnThe fixture kit includes the Base fixture (probe plate) as well as the Puhsers plate.
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PCI Express 4.0 Test Platform
The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Single Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Regenerative Battery Pack Test System
17020
Chroma's 17020 is a high precision system specifically designed for secondary battery modules and pack tests. Accurate sources and measurements ensure the test quality that is suitable to perform repetitive and reliable tests that are crucial for battery modules / packs, for both incoming or outgoing inspections as well as capacity, performance, production and qualification testing. Chroma's 17020 system architecture offers regenerative discharge designed to recycle the electric energy sourced by the battery module ei ther back to the channel s in the sys tem performing a charging function or to the utility mains in the most energy efficient manner. This feature saves electricity, reduces the facilities thermal foot print and provides a green solution by reducing the environmental impact on our planet. Chroma's 17020 system is equipped with multiple independent channels to support dedicated charge / discharge tests, on multiple battery modules / packs, each with discrete test characteristics. The channels can easily be paralleled to support higher current requirements. This feature provides the ultimate flexibility between high channel count and high current testing.
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Functional Test
cUTS
Get the essentials of measurement automation to power tests of simpler PCBAs and subassemblies. compactUTS (cUTS) is a cost-effective platform for automating manual tests of devices with fewer than fifty cable-accessible test points in manufacturing environments with moderate production volume. DUT-specific electrically keyed cables make changeover quick and easy.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Display Driver Test System
T6391
High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Test Service Offerings
ASE Industrial Holding Co., Ltd.
ASE provides a complete range of semiconductor testing services to our customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, and memory semiconductors, and other test-related services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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System to Handle Wafer Levels
AMI AW Series
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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WDXRF Wafer Analyzer
2830 ZT
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Safety Compliance Test System
EN 60601
Test system for electrical safety compliance testing of medical products in accordance with EN 60601-1, 3rd edition.The system is equipped with three test fixtures which are connected in parallel order to reduce the number of setup tasks for different variants in the course of day-to-day manufacturing processes. Its purpose is to test medical products, e. g. patient monitors, which are employed at hospitals to monitor heartbeat and oxygen saturation.Based on the integrated electrical safety tester by Associated Research, in combination with an AC power source and a switching matrix, it is possible to fully automate tests like for instance AC/DC high-voltage tests, insulation resistance measurements, earth connection tests and leakage current measurements.The required occupational safety is provided by a high-voltage safety hood in accordance with EN 501191. The entire safety technology, as well as the control PC, is mounted in an aluminum-profile cart.
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Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Semiconductor Test Software
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Test Fixture, Axial And Radial
16047A
The 16047A is designed for impedance evaluation of axial/radial lead type devices of up to 13MHz. The 16047A employs Kelvin contacts which realize a wide impedance measurement range. The contact tip can be changed according to the device shape.
