Wafer Probes
I/O pad contactor held by probe card or flying.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probers, Wafer Inspection
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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MPI SiPH Probe Systems
MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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Probe Only Manipulator
LSP
The LSP mounts to standard prober hinge mounts with easy access to service and engineering locations. This reduces the floor space per test cell, saving you significant capital expenses. And you’ll be able to quickly and easily set up your ATE to wafer probe.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wa...show more -
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ResMap or DualMap Manual Load
Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Four-Point Probe
Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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MANIFULATOR
As one of the most important module in Probe_Station, manipulator is an accurate system that probe micro distance() and contact on the electrode of semiconductor wafer, device. ECOPIA's Manipulator is very easy to use and probe arm's elastic plate is good to protect sample's surface, from being damaged by Z direction movement.
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Cryogenic Probe Station
FWPX
Lake Shore’s FWPX probe station is designed for researchers who require large-size wafer probing. The FWPX accommodates wafers up to 102 mm (4 in) in diameter and can be modified to accept up to 152 mm (6 in) wafers. This general-purpose probe station is designed for researchers or engineers conducting material characterization tests over large samples. It is also an effective unit for measuring organic materials.
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Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliabil...show more -
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Light and Energy Meter
Model 659
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure reading...show more -
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Advanced Probe Card / V type
VC Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Benchtop Discrete Component Tester
Imapact 7BT
The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability.
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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Super Silicon Resistivity and Type Tester
HS-3FC II
Super Silicon Resistivity and Type Tester is specially designed for silicon sorting，it can quickly test the silicon type, heavy-doped, resistivity and current, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. Furthermore, it integrates two probes, three probes and four probes. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacit...show more -
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Probe Station
S-1160
S-1160 Probe Station 100mm, 150mm and 200mm wafer stage's completely manual and user friendly.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Non-Contact Mapping Life Time System
MWR-2S-3
The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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MPI Manual Probe Systems
MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Probe Series
VEGA Series
MPI VEGA Prober series is ready to meet the diverse test and material handling requirements of the Laser Diode (VCSEL, EEL) and optical module markets. MPI VEGA probers are based on a highly flexible and reliable platform, enabling the test of a wide variety of device types (Wafer, Package & Singulated Die) over temperatures with the ability to handle thin/warped wafers. Multiple probing schemes are also supported with the ability to probe small pads with well-controlled needle force.
